DRV5033FAQDBZR IC isekethe edibeneyo ye-Electron

DRV5033FAQDBZR IC isekethe edibeneyo yoMfanekiso we-Electron oFakelweyo

inkcazelo emfutshane:

Uphuhliso oludibeneyo lwe-chip yesekethe edibeneyo kunye nephakheji edibeneyo yombane

Ngenxa ye-simulator ye-I/O kunye ne-bump spacing kunzima ukunciphisa ngophuhliso lwetekhnoloji ye-IC, ukuzama ukutyhala le ntsimi ukuya kwinqanaba eliphezulu i-AMD iya kwamkela itekhnoloji ye-7Nm ephucukileyo, ngo-2020 yasungulwa kwisizukulwana sesibini soyilo oluhlanganisiweyo ukuze lube yimpumelelo. i-core computing core, kunye ne-I / O kunye ne-memory interface chips usebenzisa iteknoloji evuthiweyo isizukulwana kunye ne-IP, Ukuqinisekisa ukuba ukuhlanganiswa kwesiseko sesibini sesibini esekwe kutshintshiselwano olungenasiphelo kunye nokusebenza okuphezulu, ngenxa ye-chip - ukudibanisa kunye nokudibanisa ukuyila ngokubambisana, ukuphuculwa kolawulo lwenkqubo yokupakisha (iwotshi, unikezelo lwamandla, kunye ne-encapsulation layer, iqonga lokudibanisa i-2.5 D lifikelela ngempumelelo kwiinjongo ezilindelekileyo, livula indlela entsha yophuhliso lweeprosesa zeseva eziphambili.

Thumela i-imeyile kuthi Khuphela i-Datesheet

Iinkcukacha zeMveliso

Iithegi zeMveliso

Iimpawu zeMveliso

UHLOBO	INKCAZO
Udidi	Iinzwa, iiTransducers IiSeva zeMagnetic-Izitshitshi (Ilizwe eliLizileyo)
Mfr	Texas Instruments
Uthotho	-
Iphakheji	Iteyiphu & neReel (TR) Sika iTape (CT) Digi-Reel®
Ubume benxalenye	Iyasebenza
Umsebenzi	Ukutshintsha kwe-Omnipolar
Iteknoloji	Isiphumo seHolo
Ipolarization	I-North Pole, i-Pole yaseMzantsi
Uluhlu loVavanyo	3.5mT Uhambo, 2mT Khupha
Imeko yoVavanyo	-40°C ~ 125°C
Voltage - Unikezelo	2.5V ~ 38V
Okwangoku - Ubonelelo (Ubukhulu)	3.5mA
Okwangoku-Isiphumo (Ubukhulu)	30mA
Uhlobo Lwemveliso	Vula iDrain
Iimbonakalo	-
Ubushushu bokusebenza	-40°C ~ 125°C (TA)
Uhlobo lokuNqamisa	INtaba engaphezulu
Supplier Device Package	I-SOT-23-3
Ipakethe / Ityala	TO-236-3, SC-59, SOT-23-3
Inombolo yeMveliso esisiseko	DRV5033

Uhlobo lweSekethe eDityanisiweyo

Xa kuthelekiswa nee-electron, iifotoni azikho ubunzima obungaguqukiyo, ukusebenzisana okubuthathaka, amandla okuchasana nokuphazamiseka, kwaye zifaneleke ngakumbi ukuhanjiswa kolwazi.I-Optical interconnection kulindeleke ukuba ibe yitekhnoloji engundoqo yokuqhekeza udonga lokusetyenziswa kwamandla, udonga lokugcina kunye nodonga lonxibelelwano.I-Illuminant, coupler, imodyuli, izixhobo ze-waveguide zidityanisiwe kwiimpawu eziphezulu ze-optical density optical ezifana ne-photoelectric edibeneyo yenkqubo encinci, inokuqonda umgangatho, umthamo, ukusetyenziswa kwamandla okudibanisa kwe-photoelectric ephezulu, iqonga lokudibanisa i-photoelectric kuquka i-III - V i-compound semiconductor monolithic edibeneyo (INP ) iqonga lokudibanisa i-passive, i-silicate okanye iglasi (i-planar optical waveguide, i-PLC) iqonga kunye neqonga elisekelwe kwi-silicon.

I-platform ye-InP isetyenziselwa ukuveliswa kwe-laser, i-modulator, i-detector kunye nezinye izixhobo ezisebenzayo, inqanaba lobuchwepheshe obuphantsi, ixabiso eliphezulu le-substrate;Ukusebenzisa iqonga le-PLC ukuvelisa amacandelo angenayo, ilahleko ephantsi, umthamo omkhulu;Ingxaki enkulu kumaqonga omabini kukuba izinto azihambelani ne-silicon-based electronics.Olona ncedo lubalaseleyo lokudityaniswa kwe-silicon-based photonic kukuba inkqubo iyahambelana nenkqubo ye-CMOS kwaye ixabiso lemveliso liphantsi, ngoko ke ithathwa njengeyona nto inokubakho kwi-optoelectronic kunye neskimu sokuhlanganisa yonke into.

Kukho iindlela ezimbini zokudityaniswa kwezixhobo ze-silicon-based photonic kunye neesekethe ze-CMOS.

Inzuzo yangaphambili kukuba izixhobo zefotonic kunye nezixhobo zombane zinokuphuculwa ngokwahlukileyo, kodwa ukupakishwa okulandelayo kunzima kwaye izicelo zorhwebo zilinganiselwe.Le yokugqibela inzima ukuyila kunye nokuqhuba ukuhlanganiswa kwezi zixhobo zimbini.Okwangoku, indibano ye-hybrid esekwe kuhlanganiso lwamasuntswana enyukliya lolona khetho lulungileyo

Ihlelwa ngokwendawo yesicelo

Ngokwemihlaba yesicelo, i-chip inokwahlulwa ibe yi-CLOUD data center AI chip kunye ne-terminal ehlakaniphile ye-AI chip.Ngokumalunga nomsebenzi, inokwahlulwa ibe yi-AI Training chip kunye ne-AI Inference chip.Okwangoku, imakethi yelifu ilawulwa yi-NVIDIA kunye neGoogle.Ngo-2020, i-chip ye-800AI ye-optical ephuhliswe ngu-Ali Dharma Institute iphinda ingene kukhuphiswano lokuqiqa ngefu.Kukho abadlali bokugqibela.

Iichips ze-AI zisetyenziswa ngokubanzi kumaziko edatha (IDC), iitheminali ezihambayo, ukhuseleko olukrelekrele, ukuqhuba ngokuzenzekelayo, ikhaya elihlakaniphile kunye nokunye.

Iziko leDatha

Uqeqesho kunye nokuqiqa efini, apho uninzi loqeqesho lwenziwayo ngoku.Uphononongo lomxholo wevidiyo kunye neengcebiso ezenzelwe wena kwi-Intanethi ephathwayo zizicelo zokuqiqa zamafu eziqhelekileyo.I-Nvidia Gpus zezona zibalaseleyo kuqeqesho kunye nezona zibalaseleyo ekuqiqeni.Kwangaxeshanye, i-FPGA kunye ne-ASIC ziyaqhubeka nokukhuphisana ngesabelo semakethi ye-GPU ngenxa yeenzuzo zabo zokusebenzisa amandla aphantsi kunye neendleko eziphantsi.Okwangoku, iichips zamafu ikakhulu zibandakanya iNviDIa-Tesla V100 kunye neNvidia-Tesla T4910MLU270.

Ukhuseleko olukrelekrele

Umsebenzi ophambili wokhuseleko olukrelekrele kukwakhiwa kwevidiyo.Ngokongeza i-chip ye-AI kwi-terminal yekhamera, impendulo yexesha langempela inokufezekiswa kwaye uxinzelelo lwe-bandwidth lungancitshiswa.Ukongeza, umsebenzi wokuqiqa unokudityaniswa kwimveliso yeseva yomda ukuqonda imvelaphi ye-AI yokuqiqa ngedatha yekhamera engenabukrelekrele.Iichips ze-AI kufuneka zikwazi ukusetyenzwa kwevidiyo kunye nokuchazwa kwekhowudi, ikakhulu kuthathelwa ingqalelo inani leetshaneli zevidiyo ezinokusetyenzwa kunye neendleko zokuseka itshaneli yevidiyo enye.Iitshiphusi ezimele ziquka i-HI3559-AV100, i-Haisi 310 kunye ne-Bitmain BM1684.

Ngaphambili: I-AMC1301DWVR EHLANGANISIWEYO ISETYHULA IC CHIP

Okulandelayo: IChip yeSekethe eDityanisiweyo yoqobo IC DS90UB927QSQX/NOPB

Bhala umyalezo wakho apha kwaye uwuthumele kuthi