Izinto zoMbane ze-IC Iitshiphu ezidityanisiweyo zeeSekethe zeBOM inkonzo TPS4H160AQPWPRQ1
Iimpawu zeMveliso
UHLOBO | INKCAZO |
Udidi | IiSekethe eziDityanisiweyo (ICs) |
Mfr | Texas Instruments |
Uthotho | Iimoto, AEC-Q100 |
Iphakheji | Iteyiphu & neReel (TR) Sika iTape (CT) Digi-Reel® |
SPQ | 2000T&R |
Ubume beMveliso | Iyasebenza |
Tshintsha Uhlobo | Iinjongo jikelele |
Inani leZiphumo | 4 |
Umlinganiselo - Igalelo:Imveliso | 1:1 |
Uqwalaselo Lwemveliso | Icala Eliphakamileyo |
Uhlobo Lwemveliso | N-Channel |
Ujongano | Layita icima |
Voltage - Umthwalo | 3.4V ~ 40V |
Voltage - Ubonelelo (Vcc/Vdd) | Ayifuneki |
Okwangoku-Isiphumo (Ubukhulu) | 2.5A |
Rds On (Uhlobo) | 165mOhm |
Uhlobo Longeniso | Ukungaguquli |
Iimbonakalo | Iflegi yesimo |
Ukhuseleko lweempazamo | Unyino lwangoku (oluZinzileyo), ngaphezulu kobushushu |
Ubushushu bokusebenza | -40°C ~ 125°C (TA) |
Uhlobo lokuNqamisa | INtaba engaphezulu |
Supplier Device Package | 28-HTSSOP |
Ipakethe / Ityala | 28-PowerTSSOP (0.173", 4.40mm Ububanzi) |
Inombolo yeMveliso esisiseko | TPS4H160 |
Ubudlelwane phakathi kweewafers kunye neechips
I-chip yenziwe ngaphezu kwezixhobo ze-semiconductor ze-N semiconductor I-semiconductors ngokubanzi zii-diode triodes i-field effect tubes ezincinci zamandla ezichasayo ii-inductors capacitors njl.
Kukusetyenziswa kweendlela zobugcisa ukuguqula uxinaniso lwee-electron zasimahla kwinucleus yeathom kwiqula elilisetyhula ukuguqula izinto ezibonakalayo kwinucleus yeathom ukuvelisa intlawulo elungileyo okanye engalunganga yabaninzi (i-electron) okanye ezimbalwa (imingxuma) ukuya. yenza iisemiconductors ezahlukeneyo.
I-silicon kunye ne-germanium zisetyenziswa ngokuqhelekileyo izixhobo ze-semiconductor kunye neempawu zabo kunye nezixhobo zifumaneka ngokulula kwaye zingabizi kakhulu ukuba zisetyenziswe kwezi teknoloji.
I-silicon wafer yenziwe linani elikhulu lezixhobo ze-semiconductor.Umsebenzi we-wafer, ngokuqinisekileyo, ukwenza isiphaluka kwi-semiconductors ekhoyo kwi-wafer njengoko kufuneka.
Ubudlelwane phakathi kwee-wafers kunye neetships - zingaphi ii-wafers ezikwitshiphu
Oku kuxhomekeke kubungakanani bokufa kwakho, ubungakanani bewafer yakho, kunye nesantya sesivuno.
Okwangoku, ii-wafers ezibizwa ngokuba yi-6", 12" okanye 18" zimfutshane kwi-wafer diameter, kodwa ii-intshi ziluqikelelo. Olona dayamitha lwe-wafer lwahlulahlulwe lube yi-150mm, 300mm kunye ne-450mm, kunye ne-12" ilingana ne-305mm. , ke ibizwa ngokuba yi-12" wafer ukuze kube lula.
I-wafer epheleleyo
Ingcaciso: I-wafer yi-wafer eboniswe emfanekisweni kwaye yenziwe ngesilicon ecocekileyo (Si).I-wafer liqhekeza elincinci le-silicon, eyaziwa njenge-die, epakishwe njengepellet.I-wafer ene-Nand Flash wafer, i-wafer iyasikwa kuqala, emva koko ivavanywe kwaye ukufa okungaguqukiyo, okuzinzileyo, okugcweleyo kuyasuswa kwaye kupakishwe ukwenza i-Nand Flash chip oyibona yonke imihla.
Into eseleyo kwi-wafer ke mhlawumbi ayizinzanga, yonakaliswe ngokuyinxenye, kwaye ngenxa yoko ingaphantsi komthamo, okanye yonakaliswe ngokupheleleyo.Umenzi woqobo, ngokuqwalasela uqinisekiso lomgangatho, uya kubhengeza ukuba abo bafileyo bafile kwaye abachaze ngokungqongqo njengezinto ezilahliweyo ezilahlwayo zizonke.
Ubudlelwane phakathi kokufa kunye ne-wafer
Emva kokuba ukufa kugawulwe, i-wafer yokuqala iba yile nto iboniswe kumfanekiso ongezantsi, okuyi-Downgrade Flash Wafer eseleyo.
I-wafer ekhuniweyo
Ezi zifa zishiyekileyo ziwafers ezikumgangatho ophantsi.Inxalenye esusiweyo, icandelo elimnyama, lifa eliqinisekisiweyo kwaye liya kupakishwa kwaye lenziwe kwiipellets ze-NAND ezigqityiweyo ngumenzi wokuqala, ngelixa indawo engafanelekanga, inxalenye eshiywe emfanekisweni, iyakulahlwa njengenkunkuma.