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iimveliso

Izinto zoMbane ze-IC Iitshiphu ezidityanisiweyo zeeSekethe zeBOM inkonzo TPS4H160AQPWPRQ1

inkcazelo emfutshane:


Iinkcukacha zeMveliso

Iithegi zeMveliso

Iimpawu zeMveliso

UHLOBO INKCAZO
Udidi IiSekethe eziDityanisiweyo (ICs)

Ulawulo lwamandla (PMIC)

Ukutshintsha kokusasazwa kwamandla, ukuLayisha abaqhubi

Mfr Texas Instruments
Uthotho Iimoto, AEC-Q100
Iphakheji Iteyiphu & neReel (TR)

Sika iTape (CT)

Digi-Reel®

SPQ 2000T&R
Ubume beMveliso Iyasebenza
Tshintsha Uhlobo Iinjongo jikelele
Inani leZiphumo 4
Umlinganiselo - Igalelo:Imveliso 1:1
Uqwalaselo Lwemveliso Icala Eliphakamileyo
Uhlobo Lwemveliso N-Channel
Ujongano Layita icima
Voltage - Umthwalo 3.4V ~ 40V
Voltage - Ubonelelo (Vcc/Vdd) Ayifuneki
Okwangoku-Isiphumo (Ubukhulu) 2.5A
Rds On (Uhlobo) 165mOhm
Uhlobo Longeniso Ukungaguquli
Iimbonakalo Iflegi yesimo
Ukhuseleko lweempazamo Unyino lwangoku (oluZinzileyo), ngaphezulu kobushushu
Ubushushu bokusebenza -40°C ~ 125°C (TA)
Uhlobo lokuNqamisa INtaba engaphezulu
Supplier Device Package 28-HTSSOP
Ipakethe / Ityala 28-PowerTSSOP (0.173", 4.40mm Ububanzi)
Inombolo yeMveliso esisiseko TPS4H160

 

Ubudlelwane phakathi kweewafers kunye neechips

I-chip yenziwe ngaphezu kwezixhobo ze-semiconductor ze-N semiconductor I-semiconductors ngokubanzi zii-diode triodes i-field effect tubes ezincinci zamandla ezichasayo ii-inductors capacitors njl.

Kukusetyenziswa kweendlela zobugcisa ukuguqula uxinaniso lwee-electron zasimahla kwinucleus yeathom kwiqula elilisetyhula ukuguqula izinto ezibonakalayo kwinucleus yeathom ukuvelisa intlawulo elungileyo okanye engalunganga yabaninzi (i-electron) okanye ezimbalwa (imingxuma) ukuya. yenza iisemiconductors ezahlukeneyo.

I-silicon kunye ne-germanium zisetyenziswa ngokuqhelekileyo izixhobo ze-semiconductor kunye neempawu zabo kunye nezixhobo zifumaneka ngokulula kwaye zingabizi kakhulu ukuba zisetyenziswe kwezi teknoloji.

I-silicon wafer yenziwe linani elikhulu lezixhobo ze-semiconductor.Umsebenzi we-wafer, ngokuqinisekileyo, ukwenza isiphaluka kwi-semiconductors ekhoyo kwi-wafer njengoko kufuneka.

Ubudlelwane phakathi kwee-wafers kunye neetships - zingaphi ii-wafers ezikwitshiphu

Oku kuxhomekeke kubungakanani bokufa kwakho, ubungakanani bewafer yakho, kunye nesantya sesivuno.

Okwangoku, ii-wafers ezibizwa ngokuba yi-6", 12" okanye 18" zimfutshane kwi-wafer diameter, kodwa ii-intshi ziluqikelelo. Olona dayamitha lwe-wafer lwahlulahlulwe lube yi-150mm, 300mm kunye ne-450mm, kunye ne-12" ilingana ne-305mm. , ke ibizwa ngokuba yi-12" wafer ukuze kube lula.

I-wafer epheleleyo

Ingcaciso: I-wafer yi-wafer eboniswe emfanekisweni kwaye yenziwe ngesilicon ecocekileyo (Si).I-wafer liqhekeza elincinci le-silicon, eyaziwa njenge-die, epakishwe njengepellet.I-wafer ene-Nand Flash wafer, i-wafer iyasikwa kuqala, emva koko ivavanywe kwaye ukufa okungaguqukiyo, okuzinzileyo, okugcweleyo kuyasuswa kwaye kupakishwe ukwenza i-Nand Flash chip oyibona yonke imihla.

Into eseleyo kwi-wafer ke mhlawumbi ayizinzanga, yonakaliswe ngokuyinxenye, kwaye ngenxa yoko ingaphantsi komthamo, okanye yonakaliswe ngokupheleleyo.Umenzi woqobo, ngokuqwalasela uqinisekiso lomgangatho, uya kubhengeza ukuba abo bafileyo bafile kwaye abachaze ngokungqongqo njengezinto ezilahliweyo ezilahlwayo zizonke.

Ubudlelwane phakathi kokufa kunye ne-wafer

Emva kokuba ukufa kugawulwe, i-wafer yokuqala iba yile nto iboniswe kumfanekiso ongezantsi, okuyi-Downgrade Flash Wafer eseleyo.

I-wafer ekhuniweyo

Ezi zifa zishiyekileyo ziwafers ezikumgangatho ophantsi.Inxalenye esusiweyo, icandelo elimnyama, lifa eliqinisekisiweyo kwaye liya kupakishwa kwaye lenziwe kwiipellets ze-NAND ezigqityiweyo ngumenzi wokuqala, ngelixa indawo engafanelekanga, inxalenye eshiywe emfanekisweni, iyakulahlwa njengenkunkuma.


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