Iimpawu zeMveliso

Amaxwebhu & nemidiya

Ulwahlulo lokusiNgqongileyo nokuThunyela ngaphandle

IiSekethe eziDityanisiweyo

Isekethe edibeneyo (IC) sisiphatho se-semiconductor esithwala amacandelo amancinci amaninzi afana ne-capacitors, i-diodes, i-transistors, kunye ne-resistors.Ezi zixhobo zincinci zisetyenziselwa ukubala nokugcina idatha ngoncedo lweteknoloji yedijithali okanye ye-analog.Unokucinga nge-IC njenge-chip encinci enokusetyenziswa njengesiphaluka esipheleleyo, esithembekileyo.Iisekethe ezidibeneyo zinokuba yi-counter, i-oscillator, i-amplifier, isango le-logic, i-timer, imemori yekhompyutheni, okanye i-microprocessor.

I-IC ithathwa njengesiseko sokwakha zonke izixhobo zombane zanamhlanje.Igama layo licebisa inkqubo yezinto ezininzi ezidityanisiweyo ezifakwe kwizinto ezincinci, ezenziwe nge-silicon-made semiconductor.

Imbali yeeSekethe eziDityanisiweyo 

Itekhnoloji esemva kweesekethe ezidibeneyo yaqalwa ngo-1950 nguRobert Noyce noJack Kilby eUnited States of America.I-US Air Force yayingumthengi wokuqala wale nto intsha.UJack naye uKilby uye waphumelela iBhaso leNobel kwiFiziksi ngo-2000 ngokuyila kwakhe ii-ICs ezincinci.

Kwiminyaka eyi-1.5 emva kokuqaliswa koyilo lukaKilby, uRobert Noyce wazisa inguqulelo yakhe yesekethe edibeneyo.Imodeli yakhe yasombulula imiba esebenzayo kwisixhobo sikaKilby.UNoyce naye wasebenzisa isilicon kwimodeli yakhe, ngelixa uJack Kilby esebenzisa igermanium. 

URobert Noyce kunye noJack Kilby bobabini bafumana amalungelo awodwa omenzi wase-US ngegalelo labo kwiisekethe ezidibeneyo.Basokola ngemiba yezomthetho iminyaka eliqela.Okokugqibela, zombini iinkampani zikaNoyce kunye neKilby zigqibe kwelokuba zikhuphe iilayisenisi eziye zaqanjwa kwaye zazise kwimarike enkulu yehlabathi.

Iindidi zeeSekethe eziDityanisiweyo

Kukho iindidi ezimbini zeesekethe ezidibeneyo.Zezi:

1. Analog ICs

Ii-ICs ze-Analog zinemveliso eguqukayo rhoqo, kuxhomekeke kwisiginali abayifumanayo.Ngokwethiyori, ezo ICs zinokufikelela kwinani elingenamkhawulo lamazwe.Kulolu hlobo lwe-IC, inqanaba lokuphuma lokuhamba ngumsebenzi womgca wenqanaba lokufaka uphawu.

Umgca we-ICs unokusebenza njenge-radio-frequency (RF) kunye ne-audio-frequency (AF) amplifiers.Iamplifier esebenzayo (op-amp) sisixhobo esiqhele ukusetyenziswa apha.Ukongeza, inzwa yobushushu sesinye isicelo esiqhelekileyo.Ii-ICs zomgca zinokuvula kunye nokucima izixhobo ezahlukeneyo xa uphawu lufikelela kwixabiso elithile.Ungayifumana le teknoloji kwii-oveni, izifudumezi, kunye nezifudumezi-moya. 

2. Ii-ICs zeDijithali 

Ezi zahlukile kwi-analog ICs.Azisebenzi kuluhlu olungaguqukiyo lwamanqanaba omqondiso.Endaweni yoko, basebenza kumanqanaba ambalwa asetwe kwangaphambili.Ii-ICs zedijithali zisebenza ngokusisiseko ngoncedo lwamasango anengqondo.Amasango engqiqo asebenzisa idatha yokubini.Iimpawu kwidatha yokubini zinemigangatho emibini kuphela eyaziwa njengephantsi (logic 0) kunye nephezulu (logic 1).

Ii-ICs zedijithali zisetyenziswa kuluhlu olubanzi lwezicelo ezinjengeekhompyuter, iimodem, njl.

Kutheni iiSekethe eziDityanisiweyo zidumile?

Ngaphandle kokuyilwa phantse kwiminyaka engama-30 eyadlulayo, iisekethe ezidibeneyo zisasetyenziswa kwizicelo ezininzi.Makhe sixoxe ngezinye zezinto ezinoxanduva lokuthandwa kwazo : 

1.Ukwaleka 

Kwiminyaka embalwa edlulileyo, ingeniso yeshishini le-semiconductor yafikelela kwi-350 Billion yezigidi ze-USD.I-Intel yaba negalelo elikhulu apha.Bekukho nabanye abadlali ngokunjalo, kwaye uninzi lwaba bezentengiso yedijithali.Ukuba ujonga amanani, uya kubona ukuba iipesenti ezingama-80 zeentengiso eziveliswa yishishini le-semiconductor zazivela kule marike.

Iisekethe ezidibeneyo zidlale indima enkulu kule mpumelelo.Uyabona, abaphandi beshishini le-semiconductor bahlalutya isekethe edibeneyo, izicelo zayo, kunye neenkcukacha zayo kwaye bayinyusa.

I-IC yokuqala eyakha yaqulunqwa yayine-transistors nje ezimbalwa-i-5 ukuba icace.Kwaye ngoku siyibonile i-Intel's 18-core Xeon ene-5.5 yeebhiliyoni zee-transistors.Ngaphaya koko, i-IBM's Storage Controller ine-7.1 yeebhiliyoni zeetransistors ezine-480 MB L4 cache ngo-2015.

Oku kukhula kudlale indima enkulu ekuthandeni okukhoyo kweeSekethe eziDityanisiweyo.

2. Iindleko

Kubekho iingxoxo ezininzi ngeendleko ze-IC.Ukutyhubela iminyaka, bekukho ukungaqondi malunga nelona xabiso le-IC nalo.Isizathu emva koku kukuba ii-ICs ayiseyonto ilula.Itekhnoloji iya phambili ngesantya esiphezulu, kwaye abayili beetshiphu kufuneka bahambisane nesi santya xa bebala iindleko ze-IC.

Kwiminyaka embalwa edlulileyo, ukubalwa kweendleko ze-IC esetyenziselwa ukuxhomekeka kwi-silicon die.Ngelo xesha, ukuqikelela ixabiso letshiphu kunokumiselwa ngokulula ngobungakanani bokufa.Ngelixa i-silicon iseyeyona nto iphambili ekubaleni kwabo, iingcali kufuneka ziqwalasele amanye amacandelo xa zibala iindleko ze-IC, ngokunjalo.

Ukuza kuthi ga ngoku, iingcali zifumene i-equation elula ngokufanelekileyo ukumisela ixabiso lokugqibela le-IC:

Iindleko ze-IC zokugqibela = Iindleko zePakeji + Iindleko zoVavanyo + Iindleko zokufa + Iindleko zokuThumela

Le nxaki iqwalasela zonke izinto eziyimfuneko ezidlala indima enkulu ekwenzeni itshiphu.Ukongezelela koko, kusenokubakho ezinye izinto ezinokuqwalaselwa.Eyona nto ibalulekileyo ekufuneka uyikhumbule xa uqikelela iindleko ze-IC kukuba ixabiso lingahluka ngexesha lenkqubo yokuvelisa ngenxa yezizathu ezininzi.

Kwakhona, naziphi na izigqibo zobugcisa ezithathwe ngexesha lenkqubo yokuvelisa zinokuba nempembelelo enkulu kwiindleko zeprojekthi.

3. Ukuthembeka

Ukuveliswa kweesekethe ezidibeneyo ngumsebenzi obuthathaka kakhulu njengoko ufuna zonke iinkqubo zisebenze ngokuqhubekayo ngexesha lezigidi zemijikelezo.Imimandla yangaphandle ye-electromagnetic, ubushushu obugqithisileyo, kunye nezinye iimeko zokusebenza zonke zidlala indima ebalulekileyo ekusebenzeni kwe-IC.

Nangona kunjalo, uninzi lwale miba iyapheliswa ngokusetyenziswa kovavanyo oluchanekileyo olulawulwa ngokuchanekileyo.Ayiboneleli ngeendlela ezintsha zokungaphumeleli, ukwandisa ukuthembeka kweesekethe ezidibeneyo.Singakwazi kwakhona ukumisela ukuhanjiswa kokusilela ngexesha elifutshane ngokusetyenziswa koxinzelelo oluphezulu.

Yonke le miba inceda ekuqinisekiseni ukuba isekethe edibeneyo iyakwazi ukusebenza ngokufanelekileyo.

Ngaphaya koko, nazi ezinye iimpawu zokumisela indlela yokuziphatha kweesekethe ezidibeneyo:

Ubushushu

Ubushushu bunokwahluka kakhulu, nto leyo eyenza ukuveliswa kwe-IC kube nzima kakhulu.

I-Voltage.

Izixhobo zisebenza kwi-voltage yegama elinokuthi lihluke kancinci.

Inkqubo

Olona tshintsho lubaluleke kakhulu lwenkqubo olusetyenziswa kwizixhobo lumandla ombane e-threshold kunye nobude betshaneli.Ukwahluka kwenkqubo kuhlelwe ngolu hlobo:

• Kuninzi kwiqashiso
• I-wafer kwi-wafer
• Kufa ukufa

IiPakethi zeSekethe eziDityanisiweyo

Iphakheji isonga ukufa kwesekethe edibeneyo, okwenza kube lula ngathi ukudibanisa kuyo.Uqhagamshelo ngalunye lwangaphandle kwidayiti ludityaniswe neqhekeza elincinci legolide kwiphini elikwipakethe.Izikhonkwane ziitheminali ezikhuphayo ezisilivere ngombala.Badlula kwisekethe ukuze badibanise nezinye iindawo zechip.Ezi zibaluleke kakhulu njengoko zijikeleza isekethe kwaye ziqhagamshelwe kwiingcingo kunye namanye amacandelo kwisekethe.

Kukho iintlobo ngeentlobo zeepakethe ezinokusetyenziswa apha.Zonke zineentlobo ezizodwa zokuxhoma, imilinganiselo ekhethekileyo, kunye nokubalwa kwephini.Makhe sijonge indlela oku kusebenza ngayo.

Pin Ukubala

Zonke iisekethe ezidibeneyo zi-polarized, kwaye ipini nganye ihluke ngokwemigaqo yomibini umsebenzi kunye nendawo.Oku kuthetha ukuba iphakheji kufuneka ibonise kwaye ihlukanise zonke izikhonkwane ukusuka komnye nomnye.Uninzi lwee-ICs zisebenzisa ichaphaza okanye inotshi ukubonisa isikhonkwane sokuqala.

Nje ukuba uchonge indawo yephini yokuqala, amanye amanani ephini ayanda ngokulandelelana njengoko usiya ngokukhawuntayo kwisekethe.

Ukunyuka

Ukunyuka yenye yeempawu ezizodwa zohlobo lwepakethe.Zonke iipakethe zingahlelwa njengenye yeendidi ezimbini zokunyuka: i-surface-mount (SMD okanye i-SMT) okanye umngxuma womngxuma (PTH).Kulula kakhulu ukusebenza ngeepakethe ze- Through-hole kuba zinkulu.Zenzelwe ukuba zilungiswe kwelinye icala lesekethe kwaye zithengiswe kwelinye.

Iipakethe zokunyuka komphezulu ziza ngobukhulu obahlukeneyo, ukusuka kwincinci ukuya kwi-minuscule.Zigxininiswe kwelinye icala lebhokisi kwaye zithengiswa kumphezulu.Izikhonkwane zale phakheji zi-perpendicular kwi-chip, zicinezele ngaphandle kwecala, okanye ngamanye amaxesha zibekwe kwi-matrix kwisiseko se-chip.Iisekethe ezidityanisiweyo ngendlela yentaba-phezulu nazo zifuna izixhobo ezikhethekileyo zokuqokelela.

Dual In-Line

I-Dual In-line Package (DIP) yenye yeepakethe eziqhelekileyo.Olu luhlobo lwephakheji ye-IC yomngxuma.Ezi chips zincinci zinemiqolo emibini enxuseneyo yezikhonkwane eziphuma ngokuthe nkqo ngaphandle kwendlu emnyama, iplastiki, uxande.

Izikhonkwane zinesithuba esimalunga ne-2.54 mm phakathi kwazo - umgangatho ofanelekileyo wokungena kwiibhodi zesonka kunye nezinye iibhodi ezimbalwa zeprototyping.Kuxhomekeke kwinani lephini, imilinganiselo yephakheji ye-DIP iyonke inokwahluka ukusuka ku-4 ukuya kuma-64.

Ummandla ophakathi komqolo ngamnye wezikhonkwane ucandiwe ukwenzela ukuba ii-DIP ICs zikwazi ukumelana nombindi webhodi yesonka.Oku kuqinisekisa ukuba izikhonkwane zinomqolo wazo kwaye azimfutshane.

Ulwandlalo oluNcinci

Iiphakheji ezincinci zesekethe ezidibeneyo okanye i-SOIC zifana ne-surface-mount.Yenziwe ngokugoba zonke izikhonkwane kwi-DIP kwaye icuthe phantsi.Ungazihlanganisa ezi phakheji ngesandla esizinzileyo kunye neliso elivaliweyo – Kulula ngolo hlobo!

I-Quad Flat

Iiphakheji ze-Quad Flat zidlala izikhonkwane kuzo zonke iinkalo ezine.Inani elipheleleyo lezikhonkwane kwi-quad flat IC inokwahluka naphi na ukusuka kwiipini ezisibhozo kwicala (i-32 iyonke) ukuya kwizikhonkwane ezingamashumi asixhenxe kwicala (300+ iyonke).Ezi zikhonkwane zinesithuba esimalunga ne-0.4mm ukuya kwi-1mm phakathi kwazo.Iintlobo ezincinci zepakethe ye-quad flat ziquka i-low-profile (LQFP), i-thin (TQFP), kwaye incinci kakhulu (VQFP) ipakethe.

Ball Grid Arrays

I-Ball Grid Arrays okanye i-BGA zezona phakheji ziphambili ze-IC ezijikeleze.Ezi ziyinkimbinkimbi ngokumangalisayo, iipakethi ezincinci apho iibhola ezincinci ze-solder zisekwe kwigridi ene-dimensional-dimensional kwisiseko sesekethe edibeneyo.Ngamanye amaxesha iingcali zifakela iibhola ze-solder ngokuthe ngqo kwi-die!

Iiphakheji ze-Ball Grid Arrays zihlala zisetyenziselwa ii-microprocessors eziphambili, njengeRaspberry Pi okanye i-pcDuino.