I-Chip yeSekethe ye-IC DS90UB928QSQX/NOPB entsha yoqobo

I-Chip yeSekethe ye-IC DS90UB928QSQX/NOPB entsha eFakelweyo

inkcazelo emfutshane:

Ukongeza, i-interface ye-DVI kwikhadi lemizobo yi-interface ye-DVI-I, kuquka isignali yedijithali kunye nomqondiso we-analog.Ke ngoko, amakhadi emizobo amaninzi ngaphandle kojongano lweVGA anokuguqulwa ukusuka kujongano lweDVI ukuya kujongano lweVGA ngeadaptha elula okanye isiguquli somqondiso.Ujongano lwe-DVI kunye ne-HDMI lujongano lwedijithali, ngakumbi amakhadi emizobo ane-HDMI ujongano, axhasa iprotocol ye-HDCP kwaye abeke isiseko sokubukela iinkqubo zeHD ezinelungelo lokushicilela.Nangona kunjalo, amakhadi emizobo ngaphandle kweprotocol ye-HDCP ayinakukwazi ukubukela iimuvi zeHD ezine-copyright kunye neenkqubo zeTV nokuba ziqhagamshelwe kubahloli okanye kwiTVS.

Thumela i-imeyile kuthi Khuphela i-Datesheet

Iinkcukacha zeMveliso

Iithegi zeMveliso

Iimpawu zeMveliso

UHLOBO	INKCAZO
Udidi	IiSekethe eziDityanisiweyo (ICs)Ujongano-Izilandeleli, iiDeserializers
Mfr	Texas Instruments
Uthotho	Iimoto, AEC-Q100
Iphakheji	Iteyiphu & neReel (TR)Sika iTape (CT) Digi-Reel®
Ubume benxalenye	Iyasebenza
Umsebenzi	I-Deserializer
Data Rate	2.975Gbps
Uhlobo Longeniso	FPD-Link III, LVDS
Uhlobo Lwemveliso	I-LVDS
Inani lamagalelo	1
Inani leZiphumo	13
Voltage - Unikezelo	3V ~ 3.6V
Ubushushu bokusebenza	-40°C ~ 105°C (TA)
Uhlobo lokuNqamisa	INtaba engaphezulu
Ipakethe / Ityala	I-48-WFQFN eveziweyo yePad
Supplier Device Package	48-WQFN (7x7)
Inombolo yeMveliso esisiseko	I-DS90UB928

Ukwenziwa kwe-wafer

Izinto zokuqala ze-chip yintlabathi, engumlingo wesayensi kunye nobuchwepheshe.Icandelo eliphambili lesanti yi-silicon dioxide (SiO2), kunye nesanti ekhutshwe yi-deoxidized iqulethe ukuya kuma-25 ekhulwini le-silicon, into yesibini eyona nto ininzi kumhlaba kunye nesiseko soshishino lokuvelisa i-semiconductor.

Ukunyibilikiswa kwesanti kunye nokucocwa kwamanyathelo amaninzi kunye nokucocwa kunokusetyenziselwa ukuveliswa kwe-semiconductor ye-polysilicon ecocekileyo, eyaziwa ngokuba yi-electron grade silicon, ngokomndilili kukho i-athomu enye yokungcola kwi-athomu ye-silicon yesigidi.Igolide ye-24-karat, njengoko nonke nisazi, yi-99.998% ecocekileyo, kodwa ayisulungekanga njenge-silicon yebakala lombane.

Ucoceko oluphezulu lwepolysilicon kwisithando somlilo sekristale esitsalayo, unokufumana phantse i-cylindrical enye ye-silicon ingot, ubunzima obumalunga ne-100 kg, ubunyulu be-silicon ukuya kuthi ga kwi-99.9999%.I-Wafer ibizwa ngokuba yi-Wafer, edla ngokusetyenziselwa ukwenza iitshiphusi, ngokusika i-ingots ye-crystal ye-silicon enye ngokuthe tye kwi-wafers ye-silicon enye engqukuva.

I-silicon ye-Monocrystalline ingcono kune-silicon ye-polycrystalline kwizinto zombane kunye nezomatshini, ngoko ke ukuveliswa kwe-semiconductor kusekelwe kwi-silicon ye-monocrystalline njengento esisiseko.

Umzekelo ovela ebomini unokukunceda uqonde i-polysilicon kunye ne-silicon ye-monocrystalline.Ilekese yerock bekufanele ukuba siyibonile, ubuntwana budla ngokutya okweelekese zomkhenkce njengelekese yerock, enyanisweni, yilekese enye yecrystal rock.I-polycrystalline rock candy ehambelanayo, edla ngokungaqhelekanga kwimilo, isetyenziswa kumayeza esintu okanye isuphu yaseTshayina, enesiphumo sokumanzisa imiphunga kunye nokukhulula ukhohlokhohlo.

Isakhiwo esifanayo sokulungiswa kwekristale siyahluka, ukusebenza kwayo kunye nokusetyenziswa kwayo kuya kuhluka, nokubahluko ocacileyo.

Abavelisi beSemiconductor, iifektri ezingadli ngokuvelisa iiwafa kodwa zihambisa nje iiwafa, zithenga iiwafa ngokuthe ngqo kubaboneleli beWafer.

Ukwenziwa kweWafer kumalunga nokubeka iisekethe eziyiliweyo (ezibizwa ngokuba ziimaski) kwiiwafers.

Okokuqala, kufuneka sisasaze ngokulinganayo i-photoresist kwi-wafer surface.Ngethuba le nkqubo, kufuneka sigcine i-wafer ijikeleza ukuze i-photoresist isasazeke kakhulu kwaye icwecwe.Umaleko wefotoresist emva koko utyhileke kukukhanya kwe-ultraviolet (UV) ngeMask kwaye iyanyibilika.

Imaski iprintwa ngepatheni yesekethe eyenziwe ngaphambili, apho ukukhanya kwe-ultraviolet kukhanya kwi-photoresist layer, yenza uluhlu ngalunye lwepateni yesekethe.Ngokuqhelekileyo, ipateni yesekethe oyifumana kwi-wafer yikota yepateni oyifumana kwimaski.

Isiphelo siyafana.I-Photolithography ithatha i-circuitry yoyilo kwaye iyisebenzise kwi-wafer, ekhokelela kwi-chip, njengokuba ifoto ithatha umfanekiso kwaye iphumeze into ebonakala ngayo kwifilimu.

I-Photolithography yenye yezona nkqubo zibaluleke kakhulu kwimveliso ye-chip.Nge-photolithography, sinokubeka isekethe eyiliweyo kwi-wafer, kwaye siphinde le nkqubo ukwenza iisekethe ezininzi ezifanayo kwi-wafer, nganye yazo iyi-chip eyahlukileyo, ebizwa ngokuba yi-die.Eyona nkqubo yokwenza itshiphu inzima kakhulu kunoko, idla ngokubandakanya amakhulukhulu amanyathelo.Ke i-semiconductors isithsaba sokwenza.

Ukuqonda inkqubo yokwenziwa kwetshiphu kubaluleke kakhulu kwizikhundla ezinxulumene nokuveliswa kwe-semiconductor, ngakumbi kumagcisa kwizityalo ze-FAB okanye izikhundla zokuvelisa ngobuninzi ezifana nenjineli yemveliso kunye nenjineli yovavanyo kumaqela e-chip r&d.

Ngaphambili: IChip yeSekethe eDityanisiweyo yoqobo IC DS90UB927QSQX/NOPB

Okulandelayo: I-Orignal DS90UB935TRHBRRQ1 iSekethe eHlangeneyo ye-IC CHIP

Bhala umyalezo wakho apha kwaye uwuthumele kuthi