Uhlalutyo lwe-IC chip ukusilela

Uhlalutyo lokungaphumeleli kwetshiphu ye-IC,ICIisekethe ezidibeneyo ze-chip azikwazi ukuphepha ukungaphumeleli kwinkqubo yophuhliso, ukuveliswa kunye nokusetyenziswa.Ngokuphuculwa kweemfuno zabantu zomgangatho wemveliso kunye nokuthembeka, umsebenzi wokuhlalutya ukungaphumeleli uya ubaluleka ngakumbi.Ngohlalutyo lokungaphumeleli kwetshiphu, i-IC chip yabaqulunqi inokufumana iziphene kuyilo, ukungangqinelani kwiparamitha zobugcisa, uyilo olungafanelekanga kunye nokusebenza, njl njl. Ukubaluleka kokuhlalutya ukusilela kubonakaliswa ikakhulu kwi:

Ngokweenkcukacha, ukubaluleka okuphambili kweICUhlalutyo lokusilela kwetshiphu luboniswa kule miba ilandelayo:

1. Uhlalutyo lokungaphumeleli luyindlela ebalulekileyo kunye nendlela yokumisela indlela yokungaphumeleli kwe-IC chips.

2. Uhlalutyo lweziphoso lubonelela ngolwazi oluyimfuneko ukuze kufunyaniswe isiphene esisebenzayo.

3. Uhlalutyo lokungaphumeleli lubonelela ngeenjineli zokuyila ngokuphuculwa okuqhubekayo kunye nokuphuculwa koyilo lwe-chip ukuhlangabezana neemfuno zenkcazo yoyilo.

4. Uhlalutyo lokungaphumeleli lunokuvavanya ukuphumelela kweendlela ezahlukeneyo zokuvavanya, ukubonelela ngezongezelelo eziyimfuneko zokuvavanya imveliso, kunye nokubonelela ngolwazi oluyimfuneko ekuphuculeni kunye nokuqinisekiswa kwenkqubo yokuvavanya.

Amanyathelo aphambili kunye nemixholo yohlalutyo lokusilela:

◆ Ukukhutshwa kwesekethe edibeneyo: Ngelixa ususa isiphaluka esidibeneyo, gcina ingqibelelo yomsebenzi we-chip, ugcine ukufa, i-bondpads, i-bondwires kunye ne-lead-frame, kwaye ulungiselele uvavanyo olulandelayo lokuhlalutya ukungasebenzi kwe-chip.

◆ Isibuko sokuskena se-SEM / uhlalutyo lokubunjwa kwe-EDX: uhlalutyo lwesakhiwo sezinto eziphathekayo / ukubonwa kwesiphako, uhlalutyo oluqhelekileyo lwe-micro-area yokubunjwa kwezinto, ukulinganisa okuchanekileyo kobukhulu bokubunjwa, njl.

◆ Uvavanyo lweProbe: Uphawu lombane ngaphakathi kwisixhoboICinokufumaneka ngokukhawuleza nangokulula nge-micro-probe.I-Laser: I-Micro-laser isetyenziselwa ukusika indawo ethile ephezulu yetshiphu okanye ucingo.

◆ Ukubona i-EMMI: I-EMMI i-microscope ephantsi yokukhanya yi-high-effective-effective analysis tool, ebonelela nge-high-sensitivity kunye ne-non-sruption ye-fault location method.Iyakwazi ukubona kwaye ibeke i-luminescence ebuthathaka kakhulu (ebonakalayo kwaye isondele kwi-infrared) kwaye ibambe imisinga yokuvuza okubangelwa ziziphene kunye nokungahambi kakuhle kumacandelo ahlukeneyo.

◆ I-OBIRCH isicelo (uvavanyo lwe-laser beam-induced impedance value change): I-OBIRCH isoloko isetyenziselwa ukuhlalutya okuphezulu kunye nokuhlalutya okuphantsi ngaphakathi. ICchips, kunye nomgca ukuvuza uhlalutyo indlela.Ukusebenzisa indlela ye-OBIRCH, iziphene kwiisekethe zinokufumaneka ngokufanelekileyo, njengemingxuma kwimigca, imingxuma engaphantsi kwemingxuma, kunye neendawo zokuxhathisa eziphezulu emazantsi emingxuma.Ukongezwa okulandelayo.

◆ Ukubona indawo eshushu yesikrini se-LCD: Sebenzisa isikrini se-LCD ukubona ulungelelwaniso lwemolekyuli kunye nohlengahlengiso kwindawo yokuvuza ye-IC, kwaye ubonise umfanekiso owenziwe ngebala owahlukileyo kwezinye iindawo phantsi kwe-microscope ukufumana indawo yokuvuza (inqaku lempazamo elikhulu kunelo. 10mA) eya kukhathaza umyili kuhlalutyo lwangempela.I-Fixed-point / non-fixed-point chip grinding: susa amaqhuma egolide afakwe kwi-Pad ye-chip ye-LCD yomqhubi, ukwenzela ukuba i-Pad ingonakaliswe ngokupheleleyo, ekulungele ukuhlalutya okulandelayo kunye nokubuyisela kwakhona.

◆ Uvavanyo lwe-X-Ray olungonakalisi: Fumana iziphene ezahlukeneyo kwi ICukupakishwa kwe-chip, njengokuxobula, ukugqabhuka, i-voids, ukunyaniseka kwe-wiring, i-PCB inokuba neziphene ezithile kwinkqubo yokuvelisa, njengokulungelelaniswa okungalunganga okanye i-bridging, isekethe evulekileyo, isiphaluka esifutshane okanye ukungaqhelekanga Iziphene kuqhagamshelwano, ukunyaniseka kweebhola ze-solder kwiipakethi.

◆SAM (SAT) ukufumanisa impazamo ye-ultrasonic ingakwazi ukubona ngokungenakonakala isakhiwo ngaphakathiICIphakheji ye-chip, kwaye ibone ngokufanelekileyo umonakalo ohlukeneyo obangelwa bubumanzi kunye namandla ashushu, njenge-O wafer surface delamination, iibhola ze-solder, ii-wafers okanye izigcwalisi. , iibhola ze-solder, iifayili, njl.