IForam yeSizukulwana sesi-3 seSemiconductor yowama-2022 iya kubanjelwa eSuzhou ngomhla wama-28 kweyoMnga!
Izixhobo ze-CMP zeSemiconductorkunye neSimpoziyam ekujoliswe kuyo 2022 iya kubanjelwa eSuzhou nge-29 kaDisemba!
Ngokutsho kwewebhusayithi esemthethweni kaMcLaren, kutshanje bongeze umthengi we-OEM, i-American hybrid sports car brand Czinger, kwaye iya kubonelela ngesizukulwana esilandelayo se-IPG5 800V ye-silicon carbide inverter ye-21C supercar yomthengi, ekulindeleke ukuba iqalise ukuhanjiswa kulo nyaka uzayo.
Ngokutsho kwengxelo, i-Czinger hybrid sports car 21C iya kuxhotyiswa ngee-inverters ezintathu ze-IPG5, kwaye i-peak output iya kufikelela kwi-1250 horsepower (932 kW).
Ubunzima obungaphantsi kwe-1,500 yeekhilogram, imoto yezemidlalo iya kuxhotyiswa nge-2.9-litre twin-turbocharged V8 injini evuselela ngaphezu kwe-11,000 rpm kwaye isantya ukusuka kwi-0 ukuya kwi-250 mph ngemizuzwana ye-27, ukongeza kwi-silicon carbide electric drive.
Ngomhla we-7 kaDisemba, i-website esemthethweni kaDana yazisa ukuba basayine isivumelwano sokubonelela ixesha elide kunye ne-SEMIKRON Danfoss ukukhusela amandla okuvelisa i-silicon carbide semiconductors.
Kuxelwe ukuba i-Dana iya kusebenzisa imodyuli ye-EMPack ye-silicon ye-SEMIKRON kwaye iphuhlise i-inverters yamandla aphakathi kunye aphezulu.
Ngomhla we-18 kaFebruwari kulo nyaka, i-website esemthethweni ye-SEMIKRON yathi basayine isivumelwano kunye ne-automaker yaseJamani kwi-10 + yeebhiliyoni zee-euro (ngaphezu kwe-10 yeebhiliyoni zeeyuan) inverter ye-silicon carbide.
I-SEMIKRON yasungulwa kwi-1951 njengomvelisi waseJamani weemodyuli zamandla kunye neenkqubo.Kuxelwe ukuba ngeli xesha inkampani yemoto yaseJamani yayalela iqonga elitsha lemodyuli yamandla ye-SEMIKRON eMPack®.I-platform yemodyuli yamandla e-EMPack® ilungiselelwe iteknoloji ye-silicon carbide kwaye isebenzisa iteknoloji ye-sintered "direct pressure mold mold" (DPD), kunye nokuveliswa kwevolumu ecwangciselwe ukuqala ngo-2025.
Dana Incorporatedngumboneleli weemoto waseMelika iTier1 eyasekwa ngo-1904 kwaye ikomkhulu layo lihlala eMaumee, eOhio, ngentengiso ye-8.9 yeebhiliyoni zeedola ngo-2021.
Nge-9 kaDisemba ka-2019, uDana ubonise i-SiC inverter TM4, enokubonelela ngaphezulu kwe-800 volts kwiimoto zabakhweli kunye ne-900 volts yeemoto zomdyarho.Ngaphezu koko, i-inverter inoxinano lwamandla e-195 kilowatts ilitha nganye, phantse kabini iSebe lezaMandla lase-US ekujoliswe kulo ngo-2025.
Ngokuphathelele ukutyikitya, uDana CTO Christophe Dominiak uthe: Inkqubo yethu yokufakelwa kombane iyakhula, sine-odolo enkulu engekenziwa (i-$350 yezigidi ngo-2021), kwaye ii-inverters zibalulekile.Esi sivumelwano sobonelelo seminyaka emininzi kunye neSemichondanfoss sibonelela ngenzuzo yeqhinga ngokuqinisekisa ukufikelela kwii-semiconductors ze-SIC.
Njengezona zinto ziphambili kumashishini asakhulayo acwangcisiweyo afana nonxibelelwano lwesizukulwana esilandelayo, izithuthi zamandla amatsha, kunye noololiwe abahamba ngesantya esiphezulu, isizukulwana sesithathu semiconductors esimelwe yisilicon carbide kunye ne-gallium nitride zidweliswe njengamanqaku aphambili “kwiSicwangciso seminyaka emihlanu ye-14. ” nolwandlalo losukelo lwexesha elide lowama-2035.
I-Silicon carbide i-6-intshi ye-intshi yokuvelisa i-wafer ikwixesha lokunyuka ngokukhawuleza, ngelixa abavelisi abahamba phambili abamelwe yi-Wolfspeed kunye ne-STMicroelectronics baye bafikelela kwimveliso ye-8-intshi ye-silicon carbide wafers.Abavelisi basekhaya abafana noSanan, iShandong Tianyue, iTianke Heda kunye nabanye abavelisi ikakhulu bagxile kwii-intshi ezi-6 zee-wafers, kunye neeprojekthi ezinxulumene nama-20 kunye notyalo-mali olungaphezulu kweebhiliyoni ezingama-30 zeeyuan;Ukuphumelela kweteknoloji ye-wafer yasekhaya ye-8-intshi nayo iyabambisa.Ngombulelo kuphuhliso lwezithuthi zombane kunye neziseko ezingundoqo zokutshaja, izinga lokukhula kwemarike yezixhobo ze-silicon carbide kulindeleke ukuba lifike kwi-30% phakathi kuka-2022 no-2025. I-Substrates iya kuhlala ingundoqo yokunciphisa umthamo wezixhobo ze-silicon carbide kwiminyaka ezayo.
Izixhobo ze-GaN okwangoku ziqhutywa ngokuyintloko yimakethi yokutshaja okukhawulezayo kunye nesikhululo sesiseko se-5G esikhulu kunye ne-millimeter wave iimarike ezincinci ze-RF.Imakethi ye-GaN RF ithathwa ikakhulu yiMacom, Intel, njl., kwaye imarike yamandla ibandakanya i-Infineon, iTransphorm njalo njalo.Kwiminyaka yakutshanje, amashishini asekhaya afana neSanan, Innosec, Haiwei Huaxin, njl.Ukongeza, izixhobo ze-laser ze-gallium nitride ziphuhliswe ngokukhawuleza.I-GaN semiconductor lasers isetyenziswa kwi-lithography, ukugcinwa, emkhosini, kwezonyango nakwamanye amasimi, kunye nokuthunyelwa ngonyaka malunga ne-300 yezigidi zeeyunithi kunye namazinga okukhula akutsha nje angama-20%, kwaye imarike iyonke kulindeleke ukuba ifikelele kwi-1.5 yezigidigidi zeedola ngo-2026.
I-3rd Generation Semiconductor Forum iya kubanjwa ngoDisemba 28, 2022. Inani lamashishini ahamba phambili ekhaya nakwamanye amazwe athathe inxaxheba kwinkomfa, egxininisa kumatyathanga oshishino anyukayo nasezantsi e-silicon carbide kunye ne-gallium nitride;I-substrate yamva nje, i-epitaxy, iteknoloji yokucubungula isixhobo kunye neteknoloji yokuvelisa;Inkqubela phambili yophando lwetekhnoloji yokusika ebanzi ye-bandgap semiconductors enje nge-gallium oxide, i-aluminium nitride, idayimane, kunye ne-zinc oxide ilindelwe.
Umxholo wentlanganiso
1. Impembelelo yokuvalwa kwetshiphu yase-US kuphuhliso lweesemiconductors zesizukulwana sesithathu saseTshayina
2. Imarike yehlabathi kunye neTshayina kwisizukulwana sesithathu semiconductor yemarike kunye nesimo sophuhliso lweshishini
3. Unikezelo lwamandla e-wafer kunye nemfuno kunye namathuba emarike ye-semiconductor yesizukulwana sesithathu
4. Utyalo-mali kunye nemfuno yemalike yembonakalo yeeprojekthi ze-SiC ze-intshi ezi-6
5. Imeko ekhoyo kunye nophuhliso lobuchwepheshe bokukhula kwe-SiC PVT kunye nendlela yesigaba solwelo
6. Inkqubo ye-SiC ye-8-intshi yendawo kunye nokuphumelela kwezobuchwepheshe
7. Iimarike ze-SiC kunye neengxaki zophuhliso lobugcisa kunye nezisombululo
8. Ukusetyenziswa kwezixhobo ze-GaN RF kunye neemodyuli kwizikhululo zesiseko ze-5G
9. Uphuhliso kunye nokufakwa endaweni ye-GaN kwimarike yokutshaja ngokukhawuleza
10. Iteknoloji yesixhobo se-laser ye-GaN kunye nokusetyenziswa kwemarike
11. Amathuba kunye nemingeni yendawo kunye neteknoloji kunye nophuhliso lwezixhobo
12. Okunye okulindelweyo kwisizukulwana sesithathu sophuhliso lwesemiconductor
Iikhemikhali zokugulisa ngoomatshini(i-CMP) yinkqubo ephambili yokuphumeza ukwenziwa kwe-wafer yehlabathi jikelele.Inkqubo ye-CMP iqhuba ngokwenza i-silicon wafer, ukuveliswa kwesekethe edibeneyo, ukupakishwa kunye novavanyo.Ulwelo olumenyezayo kunye nephedi yokupholisha zezona zinto zisetyenziswayo zenkqubo yeCMP, ezibalelwa ngaphezulu kwe-80% yemarike yezinto zeCMP.Izinto ze-CMP kunye nezixhobo zokusebenza ezimelwe yi-Dinglong Co., Ltd. kunye ne-Huahai Qingke zifumene ingqwalasela esondeleyo kwishishini.
Izinto ezijoliswe kuyo ziyimathiriyeli engundoqo yokulungiswa kweefilimu ezisebenzayo, ezisetyenziswa kakhulu kwi-semiconductors, iipaneli, i-photovoltaics kunye nezinye iinkalo zokuphumeza imisebenzi eqhubayo okanye yokuvimbela.Phakathi kwezixhobo eziphambili ze-semiconductor, imathiriyeli ekujoliswe kuyo yeyona nto yenziwa ekhaya.I-aluminium yasekhaya, ubhedu, i-molybdenum kunye nezinye izinto ezijoliswe kuzo zenze impumelelo, iinkampani eziphambili ezidweliswe zibandakanya i-Jiangfeng Electronics, i-Youyan New Materials, i-Ashitron, i-Longhua Technology kunye nokunye.
Iminyaka emithathu ezayo iya kuba lixesha lophuhliso olukhawulezayo lweshishini lokuvelisa i-semiconductor yaseTshayina, i-SMIC, i-Huahong Hongli, i-Changjiang Storage, i-Changxin Storage, i-Silan Micro kunye namanye amashishini ukukhawulezisa ukwandiswa kwemveliso, i-Gekewei, i-Dingtai Craftsman, i-China Resources Micro kunye nezinye. Uyilo lwamashishini lwe-12-intshi yemigca yokuvelisa i-wafer nayo iya kufakwa kwimveliso, eya kuzisa imfuno enkulu yemathiriyeli ye-CMP kunye nemathiriyeli ekujoliswe kuyo.
Phantsi kwale meko intsha, ukhuseleko lwekhonkco lonikezelo ngelaphu lwasekhaya luya lusiba lubaluleke ngakumbi nangakumbi, kwaye kuyafuneka ukulima ababoneleli bempahla bendawo abazinzileyo, nto leyo eza kuzisa amathuba amakhulu kubaboneleli basekhaya.Amava ayimpumelelo ezinto ekujoliswe kuzo nazo ziya kubonelela ngereferensi yophuhliso lwendawo yezinye izinto.
I-Semiconductor CMP Materials and Targets Symposium 2022 iya kubanjelwa eSuzhou nge-29 kaDisemba.
Umxholo wentlanganiso
1. Izinto ze-CMP zaseTshayina kunye nomgaqo-nkqubo wezinto ezijoliswe kuzo kunye neendlela zemarike
2. Impembelelo yezohlwayo zase-US kwikhonkco lokubonelela ngemathiriyeli ye-semiconductor yasekhaya
3. Izinto ze-CMP kunye nemarike ekujoliswe kuyo kunye nohlalutyo oluphambili lweshishini
4. ISemiconductor CMP yokupholisha uludaka
5. Iphedi yokupholisha ye-CMP enolwelo lokucoca
6. Inkqubela phambili yezixhobo zokupholisha zeCMP
7. Ubonelelo lwemarike ye-semiconductor kunye nemfuno
8. Iintsingiselo zamashishini ekujoliswe kuwo ngesemiconductor
9. Inkqubela phambili kwi-CMP kunye nethekhnoloji ekujoliswe kuyo
10. Amava kunye nereferensi yendawo yemathiriyeli ekujoliswe kuyo
Ixesha lokuposa: Jan-03-2023