Spartan®-7 Field Programmable Gate Array (FPGA) IC 250 2764800 52160 484-BBGA XC7S50-2FGGA484C izixhobo zombane ic iitshiphusi ezihlanganisiweyo

Iimpawu zeMveliso

Uphuhliso lwamva nje

Ukulandela isibhengezo esisemthethweni sika-Xilinx se-28nm yokuqala ye-Kintex-7 yehlabathi, inkampani isanda kutyhila okokuqala iinkcukacha ze-chips ezine ze-7 Series, i-Artix-7, i-Kintex-7, i-Virtex-7, kunye ne-Zynq, kunye nezixhobo zophuhliso ezingqongileyo. i-7 Series.

Zonke i-7 series FPGAs zisekelwe kulwakhiwo olumanyeneyo, yonke inkqubo ye-28nm, inika abathengi inkululeko yokusebenza yokunciphisa iindleko kunye nokusetyenziswa kwamandla ngelixa ukwandisa ukusebenza kunye nomthamo, ngaloo ndlela kuncitshiswa utyalo-mali kuphuhliso kunye nokusasazwa kwexabiso eliphantsi kunye eliphezulu-. iintsapho zokusebenza.Uyilo lwakha phezu kosapho oluphumelele kakhulu lweVirtex-6 lwezoyilo kwaye yenzelwe ukwenza lula ukusetyenziswa kwakhona kwezisombululo zoyilo zeVirtex-6 kunye neSpartan-6 FPGA.I-architecture nayo ixhaswa yi-EasyPath eqinisekisiweyo.Isisombululo se-FPGA sokunciphisa iindleko, esiqinisekisa i-35% yokunciphisa iindleko ngaphandle kokuguqulwa okunyukayo okanye utyalo-mali lobunjineli, ukwandisa imveliso.

UAndy Norton, i-CTO ye-System Architecture kwi-Cloudshield Technologies, inkampani ye-SAIC, yathi: "Ngokudibanisa i-architecture ye-6-LUT kunye nokusebenza kunye ne-ARM kwinkcazo ye-AMBA, iCeres iye yavumela ezi mveliso ukuba zixhase ukusetyenziswa kwakhona kwe-IP, ukuphatheka, kunye nokuqikelelwa.Uyilo oludityanisiweyo, isixhobo esitsha seprosesa-centric esitshintsha ingqondo, kunye nokuhamba koyilo olucwangcisiweyo kunye nezixhobo zesizukulwana esilandelayo akuyi kuphucula kakhulu imveliso, ukuguquguquka, kunye nokusebenza kwenkqubo-on-chip, kodwa kuya kwenza lula ukufuduka kwangaphambili. izizukulwana zoyilo lwezakhiwo.Ii-SOC ezinamandla ngakumbi zinokwakhiwa ngenxa yetekhnoloji yenkqubo ephezulu evumela ukuqhubela phambili okubonakalayo kusetyenziso lwamandla kunye nokusebenza, kunye nokufakwa kwe-A8 processor hardcore kwezinye zeechips.

Imbali yoPhuhliso lwe-Xilinx

Oct 24, 2019 - Xilinx (XLNX.US) FY2020 Q2 ingeniso phezulu 12% YoY, Q3 kulindeleke ukuba ibe yindawo ephantsi kwinkampani

Nge-30 kaDisemba, i-2021, i-AMD ye-35 yeebhiliyoni zeerandi zokufumana iCeres kulindeleke ukuba ivalwe ngo-2022, kamva kunokuba bekucwangcisiwe ngaphambili.

NgoJanuwari ka-2022, uLawulo Jikelele loLawulo lweMarike lugqibe ekubeni luvume olu xinzelelo lwabasebenzi ngeemeko ezongezelelweyo ezithintelweyo.

Ngomhla we-14 kuFebruwari 2022, i-AMD yabhengeza ukuba ikugqibile ukuthengwa kweCeres nokuba amalungu ebhodi yaseCeres uJon Olson noElizabeth Vanderslice bajoyine ibhodi ye-AMD.

I-Xilinx: ingxaki yokubonelela nge-chip yemoto ayikho nje malunga nee-semiconductors

Ngokweengxelo zeendaba, i-chipmaker yase-US u-Xilinx uye walumkisa ukuba iingxaki zokubonelela ezichaphazela ishishini leemoto aziyi kusonjululwa kungekudala kwaye ayiseyiyo nje into yokuvelisa i-semiconductor kodwa ibandakanya nabanye ababoneleli bezinto kunye namacandelo.

UVictor Peng, umongameli, kunye ne-CEO ye-Xilinx uthe kudliwanondlebe: “Ayiyiyo nje ii-wafers ezineengxaki, ii-substrates ezipakisha iitshiphusi zikwajongene nemingeni.Ngoku kukho imingeni kunye namanye amacandelo azimeleyo. ”I-Xilinx ngumthengisi ophambili kubenzi bee-automakers ezifana ne-Subaru kunye ne-Daimler.

U-Peng uthe unethemba lokuba ukunqongophala akuzukuhlala unyaka wonke kwaye iXilinx yenza konke okusemandleni ayo ukuhlangabezana neemfuno zabathengi.“Sikunxibelelwano olusondeleyo nabathengi bethu ukuqonda iimfuno zabo.Ndicinga ukuba senza umsebenzi olungileyo wokuhlangabezana neemfuno zabo eziphambili.I-Xilinx ikwasebenza ngokusondeleyo nababoneleli ukusombulula iingxaki, kubandakanya ne-TSMC. ”

Abavelisi beemoto zehlabathi bajongene nemingeni emikhulu kwimveliso ngenxa yokungabikho kwee-cores.Iitshiphusi zihlala zibonelelwa ziinkampani ezinjenge-NXP, i-Infineon, iRenesas, kunye ne-STMicroelectronics.

Ukwenziwa kweChip kubandakanya ikhonkco elide lokubonelela, ukusuka kuyilo kunye nokuveliswa ukupakisha kunye nokuvavanya, kwaye ekugqibeleni ukuhanjiswa kwiifektri zeemoto.Ngelixa ishishini liye lavuma ukuba kukho ukunqongophala kwee-chips, ezinye iibhotile ziqala ukuvela.

Izinto ze-Substrate ezifana ne-ABF (i-Ajinomoto build-up film) substrates, ezibaluleke kakhulu ukupakisha ii-chips eziphezulu ezisetyenziselwa iimoto, iiseva, kunye nezikhululo ezisisiseko, kuthiwa zijongene nokunqongophala.Abantu abaliqela abaqhelene nale meko bathi ixesha lokuhambisa i-ABF substrate landisiwe ukuya kwiiveki ezingama-30.

Umphathi we-chip supply chain uthe: "Ii-chips ze-artificial intelligence kunye ne-5G interconnects kufuneka zidle kakhulu i-ABF, kwaye imfuno kwezi ndawo sele inamandla kakhulu.Ukuphindaphinda kwemfuno yeetshiphusi zeemoto kuqinise unikezelo lwe-ABF.Ababoneleli be-ABF bayasandisa umthamo, kodwa abakakwazi ukuhlangabezana nemfuno.”

U-Peng uthe ngaphandle kokunqongophala okungazange kubonwe ngaphambili, i-Xilinx ayizukunyusa amaxabiso e-chip kunye noontanga bayo ngeli xesha.NgoDisemba kulo nyaka uphelileyo, i-STMicroelectronics yazisa abathengi ukuba izakwenyusa amaxabiso ukusukela ngoJanuwari, isithi "ukuphinda kufuneke emva kwehlobo ngequbuliso kwaye isantya sokuphinda siphinde sibeke ikhonkco lonikezelo phantsi koxinzelelo."Ngomhla we-2 kaFebruwari, i-NXP yatshela abatyali-mali ukuba abanye ababoneleli sele benyuse amaxabiso kwaye inkampani iya kufuneka idlulise iindleko ezongeziweyo, ichaza ukunyuka kwexabiso okuzayo.URenesas ukwaxelele abathengi ukuba kuza kufuneka bamkele amaxabiso aphezulu.

Njengomphuhlisi omkhulu wehlabathi we-field-programmable gate arrays (FPGAs), iitshiphusi ze-Xilinx zibalulekile kwikamva leemoto ezidityanisiweyo neziziqhubayo kunye neenkqubo zokuqhuba ezincediswayo.Iichips zayo ezicwangcisiweyo zikwasetyenziswa kakhulu kwiisathelayithi, uyilo lwetshiphu, i-aerospace, iiseva zamaziko edatha, izikhululo zesiseko se-4G kunye ne-5G, kunye nakwi-computing yobukrelekrele bokwenziwa kunye neejethi zokulwa ze-F-35 eziphambili.

U-Peng uthe zonke iitshiphusi eziphucukileyo ze-Xilinx ziveliswa yi-TSMC kwaye inkampani iya kuqhubeka isebenza ne-TSMC kwiitshiphusi ukuba nje i-TSMC igcina isikhundla sayo sobunkokeli kwishishini.Kunyaka ophelileyo, i-TSMC ibhengeze isicwangciso seebhiliyoni ezili-12 zeedola zokwakha umzi-mveliso e-US njengoko ilizwe lijonge ukuhambisa imveliso ye-chip yasemkhosini ibuyele kumhlaba wase-US.Iimveliso ezivuthiweyo zika-Celerity zibonelelwa yi-UMC kunye ne-Samsung eMzantsi Korea.

U-Peng ukholelwa ukuba lonke ishishini le-semiconductor liya kukhula ngakumbi ngo-2021 kunango-2020, kodwa ukuphinda kuqhambuke ubhubhane kunye nokunqongophala kwamacandelo nako kudala ukungaqiniseki ngekamva labo.Ngokwengxelo yonyaka ka-Xilinx, i-China ithathe indawo ye-US njengeyona ntengiso inkulu ukusukela ngo-2019, phantse i-29% yeshishini layo.