Brand entsha yoqobo yesitokhwe soqobo se-IC Izixhobo zombane ze-IC Inkxaso ye-BOM Inkonzo ye-BOM TPS22965TDSGRQ1
Iimpawu zeMveliso
| UHLOBO | INKCAZO |
| Udidi | IiSekethe eziDityanisiweyo (ICs) |
| Mfr | Texas Instruments |
| Uthotho | Iimoto, AEC-Q100 |
| Iphakheji | Iteyiphu & neReel (TR) Sika iTape (CT) Digi-Reel® |
| Ubume beMveliso | Iyasebenza |
| Tshintsha Uhlobo | Iinjongo jikelele |
| Inani leZiphumo | 1 |
| Umlinganiselo - Igalelo:Imveliso | 1:1 |
| Uqwalaselo Lwemveliso | Icala Eliphakamileyo |
| Uhlobo Lwemveliso | N-Channel |
| Ujongano | Layita icima |
| Voltage - Umthwalo | 2.5V ~ 5.5V |
| Voltage - Ubonelelo (Vcc/Vdd) | 0.8V ~ 5.5V |
| Okwangoku-Isiphumo (Ubukhulu) | 4A |
| Rds On (Uhlobo) | 16mOhm |
| Uhlobo Longeniso | Ukungaguquli |
| Iimbonakalo | Ukukhutshwa komthwalo, isantya sokubulawa silawulwa |
| Ukhuseleko lweempazamo | - |
| Ubushushu bokusebenza | -40°C ~ 105°C (TA) |
| Uhlobo lokuNqamisa | INtaba engaphezulu |
| Supplier Device Package | 8-WSON (2x2) |
| Ipakethe / Ityala | I-8-WFDFN eveziweyo yePad |
| Inombolo yeMveliso esisiseko | TPS22965 |
Yintoni ukupakisha
Emva kwenkqubo ende, ukusuka kuyilo ukuya kwimveliso, ekugqibeleni ufumana i-IC chip.Nangona kunjalo, i-chip incinci kwaye ibhityile kangangokuba inokukrwela ngokulula kwaye yonakaliswe ukuba ayikhuselwanga.Ngaphezu koko, ngenxa yobukhulu obuncinci be-chip, akulula ukuyibeka ebhodini ngesandla ngaphandle kwendlu enkulu.
Ngoko ke, inkcazo yephakheji ilandelayo.
Kukho iindidi ezimbini zeepakethi, iphakheji ye-DIP, efumaneka ngokuqhelekileyo kwizinto zokudlala zombane kwaye ibonakala ngathi i-centipede emnyama, kunye nephakheji ye-BGA, efumaneka ngokuqhelekileyo xa uthenga i-CPU kwibhokisi.Ezinye iindlela zokupakisha ziquka i-PGA (i-Pin Grid Array; i-Pin Grid Array) esetyenziswe kwii-CPU zakuqala okanye inguqu elungisiweyo ye-DIP, i-QFP (i-plastic square flat package).
Ngenxa yokuba zininzi iindlela zokupakisha ezahlukeneyo, oku kulandelayo kuya kuchaza iipakethe ze-DIP kunye ne-BGA.
Iiphakheji zemveli eziye zanyamezela iminyaka
Iphakheji yokuqala eyakwaziswa yi-Dual Inline Package (DIP).Njengoko unokubona kumfanekiso ongezantsi, i-IC chip kule phakheji ibonakala ngathi i-centipede emnyama phantsi komqolo ophindwe kabini wezikhonkwane, ezithandekayo.Nangona kunjalo, ngenxa yokuba ubukhulu becala yenziwe ngeplastiki, isiphumo sokutshatyalaliswa kobushushu sibi kwaye asikwazi ukuhlangabezana neemfuno zeechips ezikhawulezayo zangoku.Ngesi sizathu, uninzi lwee-ICs ezisetyenziswa kule phakheji ziitshiphusi ezihlala ixesha elide, njenge-OP741 kumzobo ongezantsi, okanye ii-ICs ezingadingi santya esingako kwaye zineetshiphusi ezincinci ezine-vias ezimbalwa.
I-IC chip ngasekhohlo yi-OP741, i-amplifier yombane eqhelekileyo.
I-IC ngakwesobunxele yi-OP741, i-amplifier yombane eqhelekileyo.
Ngokuphathelele iphakheji ye-Ball Grid Array (BGA), incinci kunepakethe ye-DIP kwaye inokungena lula kwizixhobo ezincinci.Ukongezelela, ngenxa yokuba izikhonkwane zibekwe phantsi kwe-chip, izikhonkwane ezininzi zetsimbi ziyakwazi ukuhlaliswa xa kuthelekiswa ne-DIP.Oku kuyenza ilungele iitshiphusi ezifuna inani elikhulu labafowunelwa.Nangona kunjalo, kubiza kakhulu kwaye indlela yokudibanisa inzima kakhulu, ngoko isetyenziswa kakhulu kwiimveliso zexabiso eliphezulu.













