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iimveliso

Brand entsha yoqobo yesitokhwe soqobo se-IC Izixhobo zombane ze-IC Inkxaso ye-BOM Inkonzo ye-BOM TPS22965TDSGRQ1

inkcazelo emfutshane:


Iinkcukacha zeMveliso

Iithegi zeMveliso

Iimpawu zeMveliso

UHLOBO INKCAZO
Udidi IiSekethe eziDityanisiweyo (ICs)

Ulawulo lwamandla (PMIC)

Ukutshintsha kokusasazwa kwamandla, ukuLayisha abaqhubi

Mfr Texas Instruments
Uthotho Iimoto, AEC-Q100
Iphakheji Iteyiphu & neReel (TR)

Sika iTape (CT)

Digi-Reel®

Ubume beMveliso Iyasebenza
Tshintsha Uhlobo Iinjongo jikelele
Inani leZiphumo 1
Umlinganiselo - Igalelo:Imveliso 1:1
Uqwalaselo Lwemveliso Icala Eliphakamileyo
Uhlobo Lwemveliso N-Channel
Ujongano Layita icima
Voltage - Umthwalo 2.5V ~ 5.5V
Voltage - Ubonelelo (Vcc/Vdd) 0.8V ~ 5.5V
Okwangoku-Isiphumo (Ubukhulu) 4A
Rds On (Uhlobo) 16mOhm
Uhlobo Longeniso Ukungaguquli
Iimbonakalo Ukukhutshwa komthwalo, isantya sokubulawa silawulwa
Ukhuseleko lweempazamo -
Ubushushu bokusebenza -40°C ~ 105°C (TA)
Uhlobo lokuNqamisa INtaba engaphezulu
Supplier Device Package 8-WSON (2x2)
Ipakethe / Ityala I-8-WFDFN eveziweyo yePad
Inombolo yeMveliso esisiseko TPS22965

 

Yintoni ukupakisha

Emva kwenkqubo ende, ukusuka kuyilo ukuya kwimveliso, ekugqibeleni ufumana i-IC chip.Nangona kunjalo, i-chip incinci kwaye ibhityile kangangokuba inokukrwela ngokulula kwaye yonakaliswe ukuba ayikhuselwanga.Ngaphezu koko, ngenxa yobukhulu obuncinci be-chip, akulula ukuyibeka ebhodini ngesandla ngaphandle kwendlu enkulu.

Ngoko ke, inkcazo yephakheji ilandelayo.

Kukho iindidi ezimbini zeepakethi, iphakheji ye-DIP, efumaneka ngokuqhelekileyo kwizinto zokudlala zombane kwaye ibonakala ngathi i-centipede emnyama, kunye nephakheji ye-BGA, efumaneka ngokuqhelekileyo xa uthenga i-CPU kwibhokisi.Ezinye iindlela zokupakisha ziquka i-PGA (i-Pin Grid Array; i-Pin Grid Array) esetyenziswe kwii-CPU zakuqala okanye inguqu elungisiweyo ye-DIP, i-QFP (i-plastic square flat package).

Ngenxa yokuba zininzi iindlela zokupakisha ezahlukeneyo, oku kulandelayo kuya kuchaza iipakethe ze-DIP kunye ne-BGA.

Iiphakheji zemveli eziye zanyamezela iminyaka

Iphakheji yokuqala eyakwaziswa yi-Dual Inline Package (DIP).Njengoko unokubona kumfanekiso ongezantsi, i-IC chip kule phakheji ibonakala ngathi i-centipede emnyama phantsi komqolo ophindwe kabini wezikhonkwane, ezithandekayo.Nangona kunjalo, ngenxa yokuba ubukhulu becala yenziwe ngeplastiki, isiphumo sokutshatyalaliswa kobushushu sibi kwaye asikwazi ukuhlangabezana neemfuno zeechips ezikhawulezayo zangoku.Ngesi sizathu, uninzi lwee-ICs ezisetyenziswa kule phakheji ziitshiphusi ezihlala ixesha elide, njenge-OP741 kumzobo ongezantsi, okanye ii-ICs ezingadingi santya esingako kwaye zineetshiphusi ezincinci ezine-vias ezimbalwa.

I-IC chip ngasekhohlo yi-OP741, i-amplifier yombane eqhelekileyo.

I-IC ngakwesobunxele yi-OP741, i-amplifier yombane eqhelekileyo.

Ngokuphathelele iphakheji ye-Ball Grid Array (BGA), incinci kunepakethe ye-DIP kwaye inokungena lula kwizixhobo ezincinci.Ukongezelela, ngenxa yokuba izikhonkwane zibekwe phantsi kwe-chip, izikhonkwane ezininzi zetsimbi ziyakwazi ukuhlaliswa xa kuthelekiswa ne-DIP.Oku kuyenza ilungele iitshiphusi ezifuna inani elikhulu labafowunelwa.Nangona kunjalo, kubiza kakhulu kwaye indlela yokudibanisa inzima kakhulu, ngoko isetyenziswa kakhulu kwiimveliso zexabiso eliphezulu.


  • Ngaphambili:
  • Okulandelayo:

  • Bhala umyalezo wakho apha kwaye uwuthumele kuthi