Uluhlu lwezixhobo zombane zeSekethe yeBom Mcu TLC7733IDR LMR33630BQRNXRQ1 LM431CIM3/NOPB TMS320F28033PAGT IC Chip

1.Uyilo lwetshiphu.

Isinyathelo sokuqala kuyilo, ukubeka iithagethi

Elona nyathelo libalulekileyo kuyilo lwe-IC lucaciso.Oku kufana nokwenza isigqibo sokuba mangaphi amagumbi kunye nezindlu zokuhlambela ozifunayo, zeziphi iikhowudi zokwakha ekufuneka uzithobele, uze uqhubeke noyilo emva kokuba umisele yonke imisebenzi ukuze ungachithi ixesha elongezelelweyo kuhlengahlengiso olulandelayo;Uyilo lwe-IC kufuneka luhambe ngenkqubo efanayo ukuze kuqinisekiswe ukuba i-chip ephumayo ayiyi kuba neempazamo.

Inyathelo lokuqala kwingcaciso kukuqinisekisa injongo ye-IC, yintoni intsebenzo, kunye nokuseta umkhombandlela jikelele.Isinyathelo esilandelayo kukubona ukuba zeziphi iiprothokholi ezifunekayo ukuhlangabezana nazo, ezifana ne-IEEE 802.11 yekhadi elingenazintambo, ngaphandle koko i-chip ayiyi kuhambelana nezinye iimveliso kwiimarike, okwenza kube nzima ukuxhuma kwezinye izixhobo.Isinyathelo sokugqibela kukuseka indlela i-IC eya kusebenza ngayo, inika imisebenzi eyahlukeneyo kwiiyunithi ezahlukeneyo kunye nokumisela indlela iiyunithi ezahlukeneyo ziya kudibaniswa ngayo enye kwenye, ngaloo ndlela igqibezela ukucaciswa.

Emva kokuyila iinkcukacha, lixesha lokuyila iinkcukacha ze-chip.Eli nyathelo lifana nomzobo wokuqala wesakhiwo, apho ulwandlalo lulonke luzotywe ukulungiselela imizobo elandelayo.Kwimeko ye-IC chips, oku kwenziwa ngokusebenzisa ulwimi lwenkcazo ye-hardware (HDL) ukuchaza isiphaluka.IiHDL ezifana neVerilog kunye neVHDL ziqhele ukusetyenziswa ukubonisa ngokulula imisebenzi ye-IC ngekhowudi yeprogram.Emva koko inkqubo ihlolwe ukuchaneka kwaye iguqulwe ide ihlangabezane nomsebenzi ofunekayo.

Uluhlu lweefotomaski, ukupakisha i-chip

Okokuqala, ngoku iyaziwa ukuba i-IC ivelisa ii-photomasks ezininzi, ezinemigangatho eyahlukeneyo, nganye inomsebenzi wayo.Umzobo ongezantsi ubonisa umzekelo olula we-photomask, usebenzisa i-CMOS, eyona nto isisiseko kwisekethe edibeneyo, njengomzekelo.I-CMOS yindibaniselwano ye-NMOS kunye ne-PMOS, eyenza i-CMOS.

Inyathelo ngalinye kula achazwe apha linolwazi olukhethekileyo kwaye linokufundiswa njengekhosi eyahlukileyo.Ngokomzekelo, ukubhala ulwimi lwenkcazo ye-hardware kufuna nje ukuqhelana nolwimi lweprogram, kodwa kunye nokuqonda indlela iisekethe ezinengqondo ezisebenza ngayo, indlela yokuguqula i-algorithms efunekayo kwiiprogram, kunye nendlela i-software ye-synthesis iguqula ngayo iinkqubo zibe ngamasango anengqondo.

2.Yintoni i-wafer?

Kwiindaba zesemiconductor, kusoloko kukho iireferensi kwiifabs ngokobungakanani, ezinje nge-8" okanye 12" iilaphu, kodwa yintoni kanye kanye iwafer?Yiyiphi inxalenye ye-8" ebhekisela kuyo? Kwaye bubuphi ubunzima bokwenza ii-wafers ezinkulu? Oku kulandelayo sisikhokelo sesinyathelo-nge-nyathelo sokuba yintoni i-wafer, isiseko esibalulekileyo se-semiconductor.

IiWafers zisisiseko sokwenza zonke iintlobo zeetshiphusi zekhompyuter.Sinokuthelekisa ukwenziwa kweetshiphu nokwakha indlu eneebloko zeLego, sizipakishe umaleko emva ko maleko ukwenza imilo enqwenelekayo (oko kukuthi iitshiphusi ezahlukeneyo).Nangona kunjalo, ngaphandle kwesiseko esilungileyo, indlu ephumayo iya kuba yinto ephosakeleyo kwaye ingabikho ukuthanda kwakho, ngoko ukwenza indlu egqibeleleyo, i-substrate egudileyo iyadingeka.Kwimeko yokwenziwa kwe-chip, le substrate yi-wafer eya kuchazwa ngokulandelayo.

Phakathi kwezinto eziqinileyo, kukho isakhiwo esikhethekileyo sekristale - i-monocrystalline.Inepropati yokuba ii-athomu zilungelelaniswe enye emva kwenye ngokusondeleyo enye kwenye, idala umphezulu othe tyaba wee-athomu.Ii-wafers ze-Monocrystalline ke ngoko zingasetyenziselwa ukuhlangabezana nezi mfuno.Nangona kunjalo, kukho amanyathelo amabini aphambili okuvelisa izinto ezinjalo, oko kukuthi ukuhlanjululwa kunye nokutsalwa kwekristale, emva koko izinto ezinokugqitywa.