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Amacandelo oMbane IC Iitshiphu eziDityanisiweyo iiSekethe XC5VFX100T-1FFG1136I IC FPGA 640 I/O 1136FCBGA

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Iinkcukacha zeMveliso

Iithegi zeMveliso

Iimpawu zeMveliso

UHLOBO INKCAZO
Udidi IiSekethe eziDityanisiweyo (ICs)IfakweFPGAs (Field Programmable Gate Array)
Mfr AMD Xilinx
Uthotho Virtex®-5 FXT
Iphakheji Itreyi
Ipakethe esemgangathweni 1
Ubume beMveliso Iyasebenza
Inani le-LABs/CLBs 8000
Inani leLogic Elements/Seli 102400
Iyonke iBits RAM 8404992
Inani le-I/O 640
Umbane – Ubonelelo 0.95V ~ 1.05V
Uhlobo lokuNqamisa INtaba engaphezulu
Ubushushu bokusebenza -40°C ~ 100°C (TJ)
Ipakethe / Ityala 1136-BBGA, FCBGA
Supplier Device Package 1136-FCBGA (35×35)
Inombolo yeMveliso esisiseko XC5VFX100

I-Xilinx: ingxaki yokubonelela nge-chip yemoto ayikho nje malunga nee-semiconductors

Ngokweengxelo zeendaba, i-chipmaker yase-US u-Xilinx uye walumkisa ukuba iingxaki zokubonelela ezichaphazela ishishini leemoto aziyi kusonjululwa kungekudala kwaye ayiseyiyo nje into yokuvelisa i-semiconductor kodwa ibandakanya nabanye ababoneleli bezinto kunye namacandelo.

UVictor Peng, umongameli, kunye ne-CEO ye-Xilinx uthe kudliwanondlebe: “Ayiyiyo nje ii-wafers ezineengxaki, ii-substrates ezipakisha iitshiphusi zikwajongene nemingeni.Ngoku kukho imingeni kunye namanye amacandelo azimeleyo. ”I-Ceres ngumthengisi ophambili kwii-automakers ezifana ne-Subaru kunye ne-Daimler.

UPeng uthe unethemba lokuba ukunqongophala akuzukuhlala unyaka wonke kwaye uCeres wenza konke okusemandleni akhe ukuhlangabezana neemfuno zabathengi.“Sikunxibelelwano olusondeleyo nabathengi bethu ukuqonda iimfuno zabo.Ndicinga ukuba senza umsebenzi olungileyo wokuhlangabezana neemfuno zabo eziphambili.UCeres ukwasebenza ngokusondeleyo nababoneleli ukusombulula iingxaki, kubandakanya neTSMC. ”

Abavelisi beemoto zehlabathi bajongene nemingeni emikhulu kwimveliso ngenxa yokungabikho kwee-cores.Iitshiphusi zihlala zibonelelwa ziinkampani ezinjenge-NXP, i-Infineon, iRenesas, kunye ne-STMicroelectronics.

Ukwenziwa kweChip kubandakanya ikhonkco elide lokubonelela, ukusuka kuyilo kunye nokuveliswa ukupakisha kunye nokuvavanya, kwaye ekugqibeleni ukuhanjiswa kwiifektri zeemoto.Ngelixa ishishini liye lavuma ukuba kukho ukunqongophala kwee-chips, ezinye iibhotile ziqala ukuvela.

Izinto ze-Substrate ezifana ne-ABF (i-Ajinomoto build-up film) substrates, ezibaluleke kakhulu ukupakisha ii-chips eziphezulu ezisetyenziselwa iimoto, iiseva, kunye nezikhululo ezisisiseko, kuthiwa zijongene nokunqongophala.Abantu abaliqela abaqhelene nale meko bathi ixesha lokuhambisa i-ABF substrate landisiwe ukuya kwiiveki ezingama-30.

Umphathi we-chip supply chain uthe: "Ii-chips ze-artificial intelligence kunye ne-5G interconnects kufuneka zidle kakhulu i-ABF, kwaye imfuno kwezi ndawo sele inamandla kakhulu.Ukuphindaphinda kwemfuno yeetshiphusi zeemoto kuqinise unikezelo lwe-ABF.Ababoneleli be-ABF bayasandisa umthamo, kodwa abakakwazi ukuhlangabezana nemfuno.”

U-Peng uthe ngaphandle kokunqongophala okungazange kubonwe ngaphambili, uCeres akazukunyusa amaxabiso e-chip kunye noontanga bakhe ngeli xesha.NgoDisemba kulo nyaka uphelileyo, i-STMicroelectronics yazisa abathengi ukuba izakwenyusa amaxabiso ukusukela ngoJanuwari, isithi "ukuphinda kufuneke emva kwehlobo ngequbuliso kwaye isantya sokuphinda siphinde sibeke ikhonkco lonikezelo phantsi koxinzelelo."Ngomhla we-2 kaFebruwari, i-NXP yatshela abatyali-mali ukuba abanye ababoneleli sele benyuse amaxabiso kwaye inkampani iya kufuneka idlulise iindleko ezongeziweyo, ichaza ukunyuka kwexabiso okuzayo.URenesas ukwaxelele abathengi ukuba kuza kufuneka bamkele amaxabiso aphezulu.

Njengomphuhlisi omkhulu wehlabathi we-field-programmable gate arrays (FPGAs), iitshiphusi zikaCeres zibalulekile kwikamva leemoto ezidityanisiweyo neziziqhubayo kunye neenkqubo zokuqhuba ezincediswayo.Iichips zayo ezicwangcisiweyo zikwasetyenziswa kakhulu kwiisathelayithi, uyilo lwetshiphu, i-aerospace, iiseva zamaziko edatha, izikhululo zesiseko se-4G kunye ne-5G, kunye nakwi-computing yobukrelekrele bokwenziwa kunye neejethi zokulwa ze-F-35 eziphambili.

U-Peng uthe zonke iitshiphusi eziphucukileyo zikaCeres ziveliswa yi-TSMC kwaye inkampani iya kuqhubeka isebenza ne-TSMC kwiitshiphusi ukuba nje i-TSMC igcina isikhundla sayo sobunkokeli kwishishini.Kunyaka ophelileyo, i-TSMC ibhengeze isicwangciso seebhiliyoni ezili-12 zeedola zokwakha umzi-mveliso e-US njengoko ilizwe lijonge ukuhambisa imveliso ye-chip yasemkhosini ibuyele kumhlaba wase-US.Iimveliso ezivuthiweyo zika-Celerity zibonelelwa yi-UMC kunye ne-Samsung eMzantsi Korea.

U-Peng ukholelwa ukuba lonke ishishini le-semiconductor liya kukhula ngakumbi ngo-2021 kunango-2020, kodwa ukuphinda kuqhambuke ubhubhane kunye nokunqongophala kwamacandelo nako kudala ukungaqiniseki ngekamva labo.Ngokwengxelo yonyaka kaCeres, iChina ithathe indawo ye-US njengeyona ntengiso inkulu ukusukela ngo-2019, phantse i-29% yeshishini layo.


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