Inkxaso ye-ic chip ye-elektroniki Inkonzo ye-BOM TPS54560BDDAR iitshiphu ezintsha ze-ic zezixhobo zombane

1.Ukubizwa kwe-IC, iphakheji yolwazi jikelele kunye nemithetho yamagama:

Uluhlu lobushushu.

C=0°C ukuya ku-60°C (ibakala lokurhweba);I=-20°C ukuya ku-85°C (ibakala lamashishini);E=-40°C ukuya ku-85°C (ibakala elongeziweyo lemizi-mveliso);A=-40°C ukuya ku-82°C (ibakala le-aerospace);M=-55°C ukuya ku-125°C (ibakala lomkhosi)

Uhlobo lwepakethe.

A-SSOP;B-CERQUAD;C-TO-200, TQFP;umphezulu wobhedu we-D-Ceramic;I-E-QSOP;F-Ceramic SOP;H- SBGAJ-Ceramic DIP;K-TO-3;L-LCC, M-MQFP;N-I-DIP emxinwa;N-DIP;Q PLCC;R - I-DIP encinci yeCeramic (300mil);S - TO-52, T - TO5, TO-99, TO-100;U-TSSOP, uMAX, SOT;W - Ububanzi obuBanzi beFom Factor (300mil) W-Wide encinci yefom factor (300 mil);X-SC-60 (3P, 5P, 6P);Umphezulu wobhedu ongu-Y-Mxinwa;Z-TO-92, MQUAD;D-Die;/ IPlastiki eyomeleziweyo;/W-Wafer.

Inani lezikhonkwane:

a-8;b-10;c-12, 192;d-14;e-16;f-22, 256;g-4;h-4;i -4;H-4;I-28;J-2;K-5, 68;L-40;M-6, 48;N 18;O-42;P-20;Umbuzo-2, 100;R-3, 843;S-4, 80;T-6, 160;U-60 -6,160;U-60;I-V-8 (ejikelezayo);W-10 (umjikelo);X-36;I-Y-8 (ejikelezayo);Z-10 (ejikelezayo).(umjikelo).

Qaphela: Unobumba wokuqala woonobumba abane isimamva seklasi yojongano ngu-E, okuthetha ukuba isixhobo sinomsebenzi we-antistatic.

2.Ukuphuhliswa kobugcisa bokupakisha

Iisekethe zokuqala ezidityanisiweyo zisebenzisa iipakethi ze-ceramic flat, eziye zaqhubeka zisetyenziswa ngumkhosi iminyaka emininzi ngenxa yokuthembeka kwazo kunye nobukhulu obuncinci.Ukupakishwa kwesekethe yezoRhwebo ngokukhawuleza kutshintshelwe kwiipakethi ezimbini ze-line, ukuqala nge-ceramic kunye neplastiki, kwaye ngo-1980 inani lepini leesekethe ze-VLSI ligqithise imida yokusetyenziswa kweepakethi ze-DIP, ekugqibeleni kukhokelele ekuveleni kwe-pin grid arrays kunye nabathwali be-chip.

Iphakheji yentaba engaphezulu yavela ekuqaleni kweminyaka yee-1980 kwaye yaduma kwinxalenye yamva yaloo minyaka ilishumi.Isebenzisa i-pin pitch ecolekileyo kwaye inemilo yephini yengabangaba okanye emile okwe-J.I-Small-Outline Integrated Circuit (SOIC), umzekelo, ine-30-50% yendawo encinci kwaye i-70% ngaphantsi kobunzima kune-DIP elinganayo.Le phakheji inezikhonkwane ezimile okwe-gull eziphuma kumacala amabini amade kunye ne-pin pitch ye-0.05".

I-Small-Outline Integrated Circuit (SOIC) kunye neephakheji ze-PLCC.ngoo-1990, nangona iphakheji ye-PGA yayisasetyenziswa rhoqo kwii-microprocessors eziphezulu.i-PQFP kunye nepakethe ebhityileyo yolwandlalo oluncinci (TSOP) yaba yiphakheji eqhelekileyo yezixhobo zokubala eziphezulu zepin.I-Intel kunye ne-AMD's high-end microprocessors zisuswe kwi-PGA (Pine Grid Array) iipakethe ukuya kwiiphakheji ze-Land Grid Array (LGA).

Iiphakheji ze-Ball Grid Array zaqala ukuvela ngo-1970, kwaye ngo-1990 iphakheji ye-FCBGA yaphuhliswa ngenani eliphezulu le-pin kunezinye iipakethe.Kwiphakheji ye-FCBGA, i-die ijikelezwe phezulu naphantsi kwaye idityaniswe kwiibhola ze-solder kwiphakheji nge-PCB-efana ne-base layer kunokuba iingcingo.Kwimarike yanamhlanje, ukupakishwa kwakhona ngoku kuyinxalenye eyahlukileyo yenkqubo, kwaye iteknoloji yephakheji inokuchaphazela umgangatho kunye nesivuno semveliso.