Iimpawu zeMveliso

Iindleko zibe ngomnye wemiba ephambili ejongene neetshiphusi ezipakishweyo ze-3D, kwaye iFoveros iya kuba sisihlandlo sokuqala i-Intel ivelisa ngomthamo ophezulu ngenxa yetekhnoloji yokupakisha ehamba phambili.I-Intel, nangona kunjalo, ithi iitshiphusi eziveliswe kwiiphakheji ze-3D Foveros zikhuphisana kakhulu ngexabiso kunye noyilo oluqhelekileyo lwe-chip-kwaye kwezinye iimeko zinokuba zincinci.

I-Intel iyile chip yeFoveros ukuba ibenexabiso eliphantsi kangangoko kwaye isahlangabezana neenjongo zokusebenza ezixeliweyo zenkampani- yeyona chip inexabiso eliphantsi kwipakethe yeMeteor Lake.I-Intel ayikabelani ngesantya sonxibelelwano lwe-Foveros / isiseko sethayile kodwa ithe amacandelo anokuqhuba kwi-GHz ezimbalwa 'kuqwalaselo lokwenziwa (ingxelo ethetha ubukho benguqulelo esebenzayo yomaleko ophakathi i-Intel sele iphuhlisa. ).Ke, i-Foveros ayifuni ukuba umyili athobe kwi-bandwidth okanye imiqobo ye-latency.

I-Intel ikwalindele ukuba uyilo lukhule kakuhle ngokwendlela yokusebenza kunye neendleko, oku kuthetha ukuba inokubonelela ngoyilo olukhethekileyo kwamanye amacandelo emarike, okanye ukwahluka kwenguqulelo yokusebenza okuphezulu.

Iindleko ze-node eziphambili nge-transistor nganye zikhula ngokukhawuleza njengoko iinkqubo ze-silicon chip zisondela kwimida yazo.Kwaye ukuyila iimodyuli ezintsha ze-IP (ezifana ne-I / O interfaces) kwiindawo ezincinci aziboneleli ngembuyekezo enkulu kutyalo-mali.Ke ngoko, ukusebenzisa kwakhona iithayile / ii-chiplets ezingabalulekanga kwi-'good enough' iindawo ezikhoyo kunokonga ixesha, iindleko, kunye nezibonelelo zophuhliso, singasathethi ke ngokwenza lula inkqubo yovavanyo.

Kwiitshiphusi enye, i-Intel kufuneka ivavanye izinto ezahlukeneyo ze-chip, ezinje ngememori okanye ujongano lwe-PCIe, ngokulandelelana, enokuthi ibe yinkqubo ethatha ixesha.Ngokwahlukileyo, abavelisi beetshiphu banokuvavanya iitshiphusi ezincinci ngaxeshanye ukonga ixesha.amaqweqwe anenzuzo ekuyileni iitshiphusi zoluhlu oluthile lwe-TDP, njengoko abayili benokwenza iitshiphusi ezincinci ezahlukeneyo ukuze zihambelane neemfuno zabo zoyilo.

Uninzi lwala manqaku luvakala luqhelekile, kwaye zonke zizinto ezifanayo ezikhokelele i-AMD phantsi kwendlela ye-chipset ngo-2017. I-AMD yayingeyokuqala ukusebenzisa i-chipset-based designs, kodwa yayingumvelisi wokuqala omkhulu ukusebenzisa le filosofi yoyilo. Ukuvelisa iitshiphusi zanamhlanje ngobuninzi, into ethi i-Intel ibonakala ngathi ifike kade.Nangona kunjalo, itekhnoloji yokupakisha ye-3D ecetywayo ye-Intel inzima kakhulu kunoyilo olusekwe kwi-AMD ye-organic intermediary-based, enezibonelelo kunye nokungalunganga.

Umahluko ekugqibeleni uya kubonakala kwiitshiphusi ezigqityiweyo, kunye ne-Intel isithi i-3D entsha egciniweyo ye-Meteor Lake kulindeleke ukuba ifumaneke ngo-2023, kunye ne-Arrow Lake kunye ne-Lunar Lake eza ngo-2024.

I-Intel ikwatsho ukuba iPonte Vecchio supercomputer chip, eya kuba neetransistors ezingaphezulu kwe-100 yeebhiliyoni, kulindeleke ukuba ibe sentliziyweni ye-Aurora, eyona khompyutha ikhawulezayo emhlabeni.