Iimpawu zeMveliso

I-Intel ityhila iinkcukacha ze-chip ye-3D: ikwazi ukupakisha ii-transistors ezibhiliyoni ezili-100, iceba ukuqaliswa ngo-2023.

I-chip ye-3D epakishwe yi-Intel isalathiso esitsha se-Intel sokucela umngeni kuMthetho kaMoore ngokubeka izinto ezinengqondo kwi-chip ukunyusa ngokumangalisayo ukuxinana kwee-CPU, ii-GPU, kunye neeprosesa ze-AI.Ngeenkqubo ze-chip ezisondele ekumeni, le inokuba yindlela yodwa yokuqhubeka nokuphucula ukusebenza.

Kutshanje, i-Intel ibonise iinkcukacha ezintsha zoyilo lwetshiphu ye-3D Foveros ye-Meteor Lake ezayo, i-Arrow Lake, kunye ne-Lunar Lake chips kwinkomfa yoshishino lwe-semiconductor eHot Chips 34.

Amahemuhemu amva nje acebise ukuba i-Intel's Meteor Lake iya kulibaziseka ngenxa yesidingo sokutshintsha i-Intel's GPU ithayile / chipset ukusuka kwi-TSMC 3nm node ukuya kwindawo ye-5nm.Ngelixa i-Intel ingekabelani ngolwazi malunga nendawo ethile eza kuyisebenzisa kwi-GPU, ummeli wenkampani wathi indawo ecwangcisiweyo yecandelo le-GPU ayitshintshanga kwaye iprosesa isendleleni yokukhululwa ngexesha ngo-2023.

Ngokucacileyo, ngeli xesha i-Intel iya kuvelisa kuphela enye yezinto ezine (inxalenye ye-CPU) esetyenziselwa ukwakha iitshiphusi zayo zeMeteor Lake-i-TSMC iya kuvelisa ezinye ezintathu.Imithombo yoshishino ibonisa ukuba i-GPU tile yi-TSMC N5 (inkqubo ye-5nm).

I-Intel yabelane ngemifanekiso yamva nje yeprosesa ye-Meteor Lake, eya kusebenzisa i-Intel's 4 process node (inkqubo ye-7nm) kwaye iya kuqala ukubetha imarike njengeprosesa ephathwayo eneecores ezinkulu ezintandathu kunye neecores ezimbini ezincinci.Iitshiphusi zeMeteor Lake kunye ne-Arrow Lake zigubungela iimfuno zeemarike zePC eziphathwayo kunye nedesktop, ngelixa iLake Lunar iya kusetyenziswa kwiincwadana ezicekethekileyo nezikhanyayo, ezigubungela i-15W nangaphantsi kwemarike.

Ukuqhubela phambili kokupakishwa kunye nokudibanisa kutshintsha ngokukhawuleza ubuso beeprosesa zanamhlanje.Zombini ngoku zibaluleke njengenkqubo esisiseko yetekhnoloji ye-node - kwaye ngokuqinisekileyo ibaluleke ngakumbi ngeendlela ezithile.

Uninzi lwezibhengezo ze-Intel ngoMvulo zigxile kwitekhnoloji yokupakisha ye-3D Foveros, eya kusetyenziswa njengesiseko se-Meteor Lake, i-Arrow Lake, kunye ne-Lunar Lake processors kwintengiso yabathengi.Le teknoloji ivumela i-Intel ukuba ibeke ngokuthe nkqo iitshiphusi ezincinci kwi-chip edibeneyo ene-Foveros edibanisayo.I-Intel isebenzisa i-Foveros kwi-Ponte Vecchio kunye ne-Rialto Bridge GPUs kunye ne-Agilex FPGAs, ngoko inokuthathwa njengobuchwephesha obusisiseko kwiimveliso ezininzi zesizukulwana esilandelayo.

I-Intel ngaphambili izise i-3D Foveros ukuthengisa kwiiprosesa zayo ze-Lakefield ezinomthamo ophantsi, kodwa i-4-tile ye-Meteor Lake kunye ne-50-tile ye-Ponte Vecchio ephantse ibe yi-50-tile ye-chips yokuqala yenkampani ukuveliswa ngobuninzi ngetekhnoloji.Emva kwe-Arrow Lake, i-Intel iya kutshintshela kunxibelelwano lwe-UCI entsha, eya kuyivumela ukuba ingene kwi-chipset ecosystem isebenzisa ujongano olusemgangathweni.

I-Intel iveze ukuba iya kubeka ii-chipsets ezine ze-Meteor Lake (ezibizwa ngokuba "ziithayile / iithayile" kwintetho ye-Intel) ngaphezulu kwe-foveros ephakathi umaleko / ithayile yesiseko.I-tile yesiseko kwi-Meteor Lake yahlukile kwi-Lakefield, enokuthi ithathwe njenge-SoC ngengqiqo.Itekhnoloji yokupakisha ye-3D Foveros ikwaxhasa umaleko osebenzayo womlamli.I-Intel ithi isebenzisa inkqubo ye-22FFL enexabiso eliphantsi kunye namandla aphantsi (efana neLakefield) ukwenza umaleko we-Foveros interposer.I-Intel ikwabonelela ngenguqu ehlaziyiweyo ye-'Intel 16′ yale node kwiinkonzo zayo zokuseka, kodwa akucaci ukuba yeyiphi inguqulelo ye-Meteor Lake base base tile Intel eza kusebenzisa.

I-Intel iya kufaka iimodyuli zekhompuyutha, iibhloko ze-I/O, iibhloko ze-SoC, kunye neebhloko zegraphics (GPUs) zisebenzisa iinkqubo ze-Intel 4 kulo maleko ophakathi.Zonke ezi yunithi ziyilwe yi-Intel kwaye zisebenzisa i-Intel yoyilo, kodwa i-TSMC iya kuba yi-OEM i-I / O, i-SoC, kunye neebhloko ze-GPU kuzo.Oku kuthetha ukuba i-Intel iya kuvelisa kuphela iibhloko ze-CPU kunye neFoveros.

Imithombo yoshishino iyavuza ukuba i-I/O iyafa kwaye i-SoC yenziwe kwinkqubo ye-N6 ye-TSMC, ngelixa i-tGPU isebenzisa i-TSMC N5.(Kufanelekile ukuqaphela ukuba i-Intel ibhekisa kwithayile ye-I/O njenge-'I/O Expander', okanye i-IOE)

Iinode ezizayo kwi-Foveros roadmap ziquka i-25 kunye ne-18-micron pitches.I-Intel ithi inokwenzeka ngokwethiyori ukufezekisa isithuba se-1-micron kwixa elizayo usebenzisa iHybrid Bonded Interconnects (HBI).