Entsha kunye neyoqobo EP4CE30F23C8 Isekethe edibeneyo ye-IC chips IC FPGA 328 I/O 484FBGA
Iimpawu zeMveliso
UHLOBO | INKCAZO |
Udidi | IiSekethe eziDityanisiweyo (ICs) Ifakwe FPGAs (Field Programmable Gate Array) |
Mfr | Intel |
Uthotho | Cyclone® IV E |
Iphakheji | Itreyi |
Ipakethe esemgangathweni | 60 |
Ubume beMveliso | Iyasebenza |
Inani le-LABs/CLBs | 1803 |
Inani leLogic Elements/Seli | 28848 |
Iyonke iBits RAM | 608256 |
Inani le-I/O | 328 |
Umbane – Ubonelelo | 1.15V ~ 1.25V |
Uhlobo lokuNqamisa | INtaba engaphezulu |
Ubushushu bokusebenza | 0°C ~ 85°C (TJ) |
Ipakethe / Ityala | 484-BGA |
Supplier Device Package | 484-FBGA (23×23) |
Inombolo yeMveliso esisiseko | EP4CE30 |
I-DMCA
Kwi-DCAI, i-Intel ibhengeze imephu yendlela yesizukulwana esilandelayo seemveliso ze-Intel Xeon eziza kukhutshwa ngo-2022-2024.
Ngokutsho kweteknoloji, i-Intel iya kuhambisa iiprosesa zeSapphire Rapids kwi-Intel 7 kwikota yokuqala ye-2022;I-Emerald Rapids icwangciselwe ukufumaneka ngo-2023;I-Sierra Forest isekelwe kwinkqubo ye-Intel 3 kwaye iya kunika amandla aphezulu kunye ne-ultra-high-high-energy, kunye ne-Granite Rapids isekelwe kwinkqubo ye-Intel 3 kwaye iya kufumaneka ngo-2024. I-Granite Rapids iya kuphuculwa kwi-Intel 3 kwaye iya iyafumaneka ngo-2024.
Nangona kunjalo, njengoko kubikwe yiComputerBase ngoJuni, kwiNkomfa yeBanc of America Securities Global Technology, uSandra Rivera, umphathi jikelele we-Intel's Data Centre kunye ne-Artificial Intelligence Business Unit, wathi i-Sapphire Rapids ramp-up ayizange ihambe njengoko bekucwangcisiwe kwaye yafika kamva. kunokuba i-Intel ibilindele.Akwaziwa ukuba ii-node zenkqubo zamva ziya kuchatshazelwa kukulibaziseka kweSapphire Rapids.
NgoFebruwari, i-Intel ikwabhengeze iprosesa ekhethekileyo ye "Falcon Shores", ebizwa ngokuba yi-XPU, eyathi i-Intel iya kusekelwa kwiqonga leprosesa le-X86 Xeon (i-socket interface ehambelanayo) kwaye idibanise ii-Xe HPC GPUs zekhompyuter esebenza kakhulu, kunye nesiseko esiguquguqukayo. I-XPU iya kusekelwa kwiqonga leprosesa ye-X86 Xeon (i-socket interface ehambelanayo) ngelixa idibanisa i-Xe HPC GPUs ye-computing esebenza kakhulu, kunye nezibalo eziphambili eziguquguqukayo, ezidityaniswe nokupakishwa kwesizukulwana esilandelayo, imemori kunye nobuchwepheshe be-IO ukwenza "i-APU" enamandla.Ngokwenkqubo yokuvelisa, i-Intel ibonise ukuba i-Falcon Shores iya kusebenzisa inkqubo yokuvelisa i-imeyile, kwaye kulindeleke ukuba ifumaneke malunga ne-2024-2025.
Foundry
I-Intel isebenze ngokukodwa kwi-Foundry space ukususela kwisicwangciso sayo se-IDM 2.0 ngo-2021. Oku kubonakala kwizicwangciso ze-Intel ezilandelelanayo zokuvelisa.
Ngo-Matshi 2021, i-Intel ibhengeze i-US $ 20 yeebhiliyoni zotyalo-mali kwiimpahla ezimbini ezintsha e-Arizona, e-US NgoSeptemba waloo nyaka, ukwakhiwa kwaqala kwizityalo ezimbini ze-chip, ekulindeleke ukuba zisebenze ngokupheleleyo ngo-2024.
NgoMeyi ka-2021, i-Intel yabhengeza i-US $ 3.5 yebhiliyoni yotyalo-mali kwi-chip fab eNew Mexico, e-USA, kubandakanywa nokwaziswa kwesisombululo se-3D sokupakisha, i-Foveros, ukunyusa izakhono zokupakisha eziphuculweyo ze-New Mexico yokupakisha.
NgoJanuwari 2022, i-Intel ibhengeze ukwakhiwa kweefektri ezimbini zetshiphu e-Ohio, eU.SA, kunye notyalo-mali lokuqala olungaphezu kwe-US $ 20 yezigidigidi, ekulindeleke ukuba iqalise ukwakhiwa kulo nyaka kwaye isebenze ekupheleni kuka-2025. NgoJulayi kulo nyaka. Iindaba zaqhekeka ukuba ukwakhiwa kwe-Intel entsha ye-Ohio fab sele iqalile.
NgoFebruwari ka-2022, i-Intel kunye ne-Israel esisiseko se-Tower Semiconductor yabhengeza isivumelwano apho i-Intel yayiza kufumana i-Tower nge-53 yeedola ngesabelo semali, ngexabiso leshishini lilonke elimalunga neebhiliyoni ezi-5.4 zeedola.
NgoMatshi ka-2022, i-Intel yabhengeza ukuba iza kutyala imali ukuya kuthi ga kwi-80 yeebhiliyoni zeedola (iibhiliyoni ezingama-88 zeedola) eYurophu kulo lonke ikhonkco lexabiso le-semiconductor kule minyaka ilishumi izayo, kwiindawo ezisusela kuphuhliso lwetshiphu kunye nemveliso ukuya kubuchwephesha bokupakisha obuphambili.Isigaba sokuqala sesicwangciso sotyalo-mali se-Intel siquka i-17 yeebhiliyoni zeerandi zotyalo-mali eJamani ukuze kwakhiwe indawo yokwenziwa kwe-semiconductor ephucukileyo;ukwenziwa kweR&D entsha kunye neziko loyilo eFransi;kunye notyalo-mali kwi-R&D, ukwenziwa, kunye neenkonzo ezisisiseko eIreland, eItali, ePoland naseSpain.
Ngomhla we-11 kuTshazimpuzi ka-2022, i-Intel yazisa ngokusesikweni ukwandiswa kwendawo yayo ye-D1X e-Oregon, e-USA, kunye nokwandiswa kwe-270,000-square-foot kunye ne-US $ 3 yebhiliyoni yotyalo-mali, eya kwandisa ubukhulu beziko le-D1X ngeepesenti ezingama-20 xa igqityiwe.
Ukongeza kulwandiso olunesibindi lwe-fab, i-Intel iphinda iphumelele kwinkalo yeenkqubo eziphambili.
Imephu yenkqubo yamva nje ye-Intel ityhila ukuba i-Intel iya kuba neendawo ezintlanu zokuzivelela kwiminyaka emine ezayo.Phakathi kwabo, i-Intel 4 kulindeleke ukuba ifakwe kwimveliso kwisiqingatha sesibini salo nyaka;I-Intel 3 kulindeleke ukuba iveliswe ngo-2023;I-Intel 20A kunye ne-Intel 18A iya kufakwa kwimveliso ngo-2024. Kwiintsuku ezimbalwa ezidlulileyo, u-Song Jijiang, umlawuli we-Intel China Research Institute, utyhile kwiNkomfa ye-Chip yaseChina yeComputer Society ukuba ukuthunyelwa kwe-Intel 7 kulo nyaka kudlule i-35 yezigidi zeeyunithi, kunye ne-Intel. I-18A kunye ne-Intel 20A R&D zombini yenze inkqubela entle kakhulu.
Ukuba inkqubo ye-Intel inokufezekisa isicwangciso kwishedyuli, oko kuthetha ukuba i-Intel iya kuba phambi kwe-TSMC kunye ne-Samsung kwindawo ye-2nm kwaye ibe ngowokuqala ukuya kwimveliso.
Ngokuphathelele abathengi abasisiseko, i-Intel ibhengeze intsebenziswano yobuchule kunye neMediaTek kungekudala.Ukongeza, kwintlanganiso yemivuzo yamva nje, i-Intel iveze ukuba iinkampani ezintandathu ze-TOP 10 zehlabathi zoyilo lwetshiphu zisebenza ne-Intel.
Iyunithi yoshishino ye-Accelerated Computing Systems and Graphics Division (AXG) yasekwa ngoJuni kulo nyaka uphelileyo kwaye ibandakanya ngokukodwa amacandelwana amathathu: i-Visual Computing, i-Supercomputing, kunye neQela leKhompyutha eliSiko.Njengenjini enkulu yokukhula ye-Intel, u-Pat Gelsinger ulindele ukuba icandelo le-AXG lizise ngaphezu kwe-10 yeebhiliyoni zeedola kwingeniso ngo-2026. I-Intel iya kuthumela ngaphezu kwe-4 yezigidi zamakhadi e-graphics discrete ngo-2022.
NgoJuni 30, uRaja Koduri, usekela-mongameli olawulayo weqela le-Intel le-AXG lekhompiyutha yesiko, ubhengeze ukuba i-Intel namhlanje iqalile ukuhambisa i-Intel Blockscale ASICs, itshiphu yesiko elinikezelwe kwimigodi, kunye nabasebenzi basezimayini be-cryptocurrency njengeArgo, GRIID, kunye ne-HIVE njengabathengi bokuqala. .Ngomhla we-30 kaJulayi, uRaja Koduri waphinda wathetha kwi-akhawunti yakhe ye-Twitter ukuba i-AXG iya kuba neemveliso ezi-4 ezitsha eziphuma ekupheleni kwe-2022.
Mobileye
I-Mobileye yenye indawo yoshishino esahlumayo ye-Intel, eyachitha i-15.3 yeebhiliyoni zeedola ukufumana i-Mobileye ngo-2018. nangona yayiculwa malunga, i-Mobileye iphumelele ingeniso ye-460 yezigidi zeedola kwikota yesibini yalo nyaka, i-41% ukusuka kwi-327 yezigidi zeedola ngexesha elifanayo. kunyaka ophelileyo, iyenza ibe yeyona ndawo iqaqambileyo kwingxelo yengeniso ye-Intel.Eyona nto ibalulekileyo.Kuyaqondwa ukuba kwisiqingatha sokuqala salo nyaka, inani langempela lee-chips ze-EyeQ ezithunyelwayo zaziyi-16 yezigidi, kodwa imfuno yokwenene yee-odolo ezifunyenweyo yayiyi-37 yezigidi, kwaye inani lee-odolo ezingathunyelwanga liyaqhubeka nokukhula.
NgoDisemba kulo nyaka uphelileyo, i-Intel yabhengeza ukuba i-Mobileye iya kukhululeka ngokuzimeleyo e-US ngexabiso elingaphezulu kwe-50 yeebhiliyoni zeedola, kunye nexesha elicwangcisiweyo phakathi konyaka.Nangona kunjalo, uPat Gelsinger utyhile ngexesha lekota yesibini yokufumana umnxeba ukuba i-Intel iya kuthathela ingqalelo iimeko ezithile zentengiso kwaye ityhale uluhlu oluzimeleyo lweMobileye kamva kulo nyaka.Nangona kungaziwa ukuba ngaba i-Mobileye iya kukwazi ukuxhasa ixabiso lemarike ye-50 yeebhiliyoni zeedola ngelixa lihamba esidlangalaleni, kufuneka kuthiwe i-Mobileye inokuba yintsika entsha ye-Intel yeshishini, ngokugweba kwisantya esinamandla sokukhula kweshishini.