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iimveliso

Itshiphu yoqobo ye-IC eLungiselekayo FPBGA XCZU7EV-2FFVF1517I iisekethe ezidibeneyo zombane IC SOC CORTEX-A53 1517FCBGA

inkcazelo emfutshane:


Iinkcukacha zeMveliso

Iithegi zeMveliso

Iimpawu zeMveliso

UHLOBO INKCAZO
Udidi IiSekethe eziDityanisiweyo (ICs)Ifakwe

Inkqubo kwiChip (SoC)

Mfr AMD Xilinx
Uthotho Zynq® UltraScale+™ MPSoC EV
Iphakheji Itreyi
Ipakethe esemgangathweni 1
Ubume beMveliso Iyasebenza
Uyilo lwezakhiwo MCU, FPGA
Iprosesa engundoqo IQuad ARM® Cortex®-A53 MPCore™ eneCoreSight™, iDual ARM®Cortex™-R5 eneCoreSight™, iARM Mali™-400 MP2
Ubungakanani beFlash -
Ubungakanani be-RAM 256 KB
Iiperipherals I-DMA, WDT
Uqhagamshelwano CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Isantya 533MHz, 600MHz, 1.3GHz
Iimpawu eziphambili I-Zynq®UltraScale+™ FPGA, 504K+ Iiseli zeNgcaciso
Ubushushu bokusebenza -40°C ~ 100°C (TJ)
Ipakethe / Ityala 1517-BBGA, FCBGA
Supplier Device Package 1517-FCBGA (40×40)
Inani le-I/O 464
Inombolo yeMveliso esisiseko XCZU7

I-Sprint ye-high-performance computing

Nangona bobabini bevela kwi-Cents Semiconductor, abasunguli be-Intel bavela kwi-R & D kunye nabasunguli be-AMD bavela kwiintengiso, ezibeka inqanaba lokwahluka kwezinye iindlela zophuhliso phakathi kwezi zibini kwiminyaka yokuqala.

Oku kwakhokelela kwezinye izithintelo zobugcisa kwiminyaka yokuqala, kwaye emva kokugqitywa "kwesimangalo senkulungwane" kunye ne-Intel iminyaka emininzi, i-AMD yandisa utyalo-mali kuphando nophuhliso.Kodwa ke kwafika ukufunyanwa kwe-ATI, eyayijongene nengxaki yokopha kwemali.

Ezi mvelaphi ziye zagcina uphuhliso lwe-AMD kwintsimi ye-CPU phantsi komthunzi we-Intel, kwaye ukufunyanwa kwe-ATI kuye kwanika i-AMD imbangi eyongezelelweyo kwintsimi ye-GPU, ekhula ngokuthe ngcembe, kodwa i-AMD isebenzisa indlela yophuhliso lwe-CPU + ye-GPU ukuqhubeka. ukufumana isabelo semarike.

 

I-Xilinx, eyafunyanwa yi-AMD ngeli xesha, sele ibambe i-50% yesabelo semarike ye-FPGAs, ngelixa i-Altera, eyafunyanwa yi-Intel ngo-2015, ibambe malunga ne-30%.

Isizathu sokuba kutheni i-FPGAs zibalulekile kwixesha langoku le-computing ekrelekrele kungenxa yenzuzo yazo yokuba ziqwalaselwe ngokuguquguqukayo.Ishishini loyilo lwetshiphu ngaphakathi kwiintatheli, ukusetyenziswa kweFPGA, nokuba iimveliso zechip zenziwe, kodwa zinokuphinda zicwangciswe okanye ziphuculwe.

Kwiminyaka yakutshanje, i-Xilinx iphinda ikhangele indawo entsha yokuphuhliswa kweemarike, isikhungo sedatha yimarike enethemba eliphezulu.Ngaphambili, uVictor Peng, owayengumongameli kunye ne-CEO ye-Xilinx, uphendule kwi-21st Century Business Herald ukuba nangona ishishini ledatha yedatha lenze igalelo elincinci kakhulu kwingeniso yenkampani, "kubalulekile ukubona ukuba ikhula ngokukhawuleza kunoko jikelele. ishishini kwaye liya kuba yinxalenye ebaluleke kakhulu kwingeniso kwixesha elizayo. "

Iziphumo ze-Xilinx 'Q3 FY2022, ezikhutshwe ngaphambi kokufunyanwa, zibonise ukuba icandelo ledatha yedatha libalelwa kwi-11% yengeniso yenkampani, kunye nesabelo sayo sikhula ngokuthe ngcembe kwikota nganye kunye nezinga lokukhula lonyaka le-81%.

Ukuya kuthi ga ngoku, iiFPGAs ngokwazo ziye kulwahlulo olutsha.Abanye ababukeli be-chip baxelele iintatheli ukuba imfuno yentengiso yeetshiphusi zeFPGA esulungekileyo sele ihlile, kwaye kwixa elizayo, izisombululo zayo ezidibeneyo ezidibeneyo kunye ne-CPUs kunye ne-DSP ziya kuba yeyona nto iphambili kwimarike, eya kuba luncedo kwimimandla efana nedatha. amaziko, 5G kunye AI.

Oku kukwabonakaliswa kwiplani yokufumana ye-AMD, apho inkampani ichaza ukuba ii-FPGA ezikhokelayo zeXilinx, ii-SoCs eziguquguqukayo, iinjini zobukrelekrele bokwenziwa, kunye nobuchule besoftware iya kuxhobisa i-AMD ukuzisa ipotfoliyo ebalaseleyo yokusebenza okuphezulu kunye nezisombululo eziguquguqukayo zekhompyuter.kwaye ubambe isabelo esikhulu selifu elimalunga ne-135 yeebhiliyoni zeedola, i-edge computing, kunye nokhuphiswano lwemakethi yesixhobo esikrelekrele ngo-2023.

I-AMD iphinde yakhankanya inkxaso ekuza kuziswa ngayo ukufunyanwa kweXilinx kwimiba yobugcisa neyemali yenkampani.

Kwicala letekhnoloji, iya kuqinisa amandla e-AMD kwi-chip stacking, i-chip packaging, i-Chiplet, njl., kunye nokubonelela ngeqonga lesoftware elingcono le-AI, izakhiwo ezikhethekileyo, njl.


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