Yoqobo IC XCKU025-1FFVA1156I Chip Isekethe eDityanisiweyo IC FPGA 312 I/O 1156FCBGA

I-IC yoqobo XCKU025-1FFVA1156I Chip eDityanisiweyo yeSekethe IC FPGA 312 I/O 1156FCBGA Umfanekiso okhoyo

inkcazelo emfutshane:

Kintex® UltraScale™ Field Programmable Gate Array (FPGA) IC 312 13004800 318150 1156-BBGA、FCBGA

Thumela i-imeyile kuthi Khuphela i-Datesheet

Iinkcukacha zeMveliso

Iithegi zeMveliso

Iimpawu zeMveliso

UHLOBO	UMZEKELISO
udidi	IiSekethe eziDityanisiweyo (ICs) Ifakwe I-Field Programmable Gate Arrays (FPGAs)
umenzi	AMD
uthotho	Kintex® UltraScale™
usonga	isambuku
Ubume bemveliso	Iyasebenza
I-DigiKey iyacwangciswa	Ayingqinwanga
Inombolo ye-LAB/CLB	18180
Inani lengqiqo/iiyunithi	318150
Lilonke inani le-RAM bits	13004800
Inani le-I/Os	312
Umbane - Ubonelelo lwamandla	0.922V ~ 0.979V
Uhlobo lofakelo	Uhlobo lokuncamathelisa ubuso
Ubushushu bokusebenza	-40°C ~ 100°C (TJ)
Ukupakishwa/Izindlu	1156-BBGA,FCBGA
Ukufakwa kwecandelo lomthengisi	1156-FCBGA (35x35)
Inombolo master Product	XCKU025

Amaxwebhu & nemidiya

UHLOBO LWEZIBONELELO	LINK
Ishiti yedatha	I-Kintex® UltraScale™ FPGA Datasheet
Ulwazi lokusingqongileyo	Isiqinisekiso se-Xiliinx RoHS I-Xilinx REACH211 Cert
PCN uyilo/ingcaciso	Ultrascale & Virtex Dev Spec Chg 20/Dec/2016

Ukuhlelwa kokusingqongileyo kunye neenkcukacha zokuthumela ngaphandle

UMBALI	UMZEKELISO
Ubume beRoHS	Iyahambelana nomyalelo we-ROHS3
iNqanaba lokuSensitivity lokufuma (MSL)	4 (72 iiyure)
FIKA ubume	Ayixhomekekanga kwiinkcukacha ze-REACH
ECCN	3A991D
HTSUS	8542.39.0001

Intshayelelo yeMveliso

FCBGA(Flip Chip Ball Grid Array) imele "flip chip ball grid Array".

I-FC-BGA(I-Flip Chip Ball Grid Array), ebizwa ngokuba yi-flip chip ibhola yegridi yoluhlu lwefomati yephakheji, ikwayeyona fomati yephakheji ibalulekileyo yeetshiphusi zokukhawulezisa imizobo okwangoku.Le teknoloji yokupakisha yaqala ngo-1960s, xa i-IBM ivelisa oko kubizwa ngokuba yiC4 (Controlled Collapse Chip Connection) iteknoloji yokuhlanganisa iikhomputha ezinkulu, emva koko iphuhliswe ngakumbi ukusebenzisa ukuxinana komphezulu weqhuma elityhidiweyo ukuxhasa ubunzima bechip. kwaye ulawule ukuphakama kwe-bulge.Kwaye ube ngumkhombandlela wophuhliso lwetekhnoloji yeflip.

Zeziphi iingenelo zeFC-BGA?

Okokuqala, iyasombululaukuhambelana kwe-electromagnetic(EMC) kunyeukuphazamiseka kwe-electromagnetic (EMI)iingxaki.Ngokuqhelekileyo, ukuhanjiswa komqondiso we-chip usebenzisa iteknoloji yokupakisha ye-WireBond iqhutyelwa ngocingo lwentsimbi kunye nobude obuthile.Kwimeko ye-frequency ephezulu, le ndlela iya kuvelisa into ebizwa ngokuba yi-impedance effect, yenza umqobo kwindlela yomqondiso.Nangona kunjalo, iFC-BGA isebenzisa iipellets endaweni yezikhonkwane ukuqhagamshela iprosesa.Le phakheji isebenzisa iibhola ze-479 ezipheleleyo, kodwa nganye ine-diameter ye-0.78 mm, enika umgama omfutshane wokudibanisa wangaphandle.Ukusebenzisa le phakheji ayinikezeli kuphela ukusebenza kombane okugqwesileyo, kodwa ikwanciphisa ilahleko kunye ne-inductance phakathi koqhagamshelo lwecandelo, kunciphisa ingxaki yokuphazamiseka kwe-electromagnetic, kwaye inokumelana nee-frequencies eziphezulu, ukophula umda we-overclocking kunokwenzeka.

Okwesibini, njengoko abayili betshiphu bebonisa ngakumbi nangakumbi iisekethe ezishinyeneyo kwindawo enye yesilicon yekristale, inani leetheminali zegalelo kunye nemveliso kunye nezikhonkwane ziya kwanda ngokukhawuleza, kwaye enye inzuzo yeFC-BGA kukuba inokunyusa ingxinano ye-I/O. .Ngokuqhelekileyo, i-I / O ikhokela usebenzisa iteknoloji ye-WireBond icwangciswe malunga ne-chip, kodwa emva kwephakheji ye-FC-BGA, i-I / O ikhokelayo inokulungiswa ngokulandelelana kumphezulu we-chip, inika ubuninzi obuphezulu be-I / O. uyilo, okukhokelela kowona msebenzi ubalaseleyo, kwaye ngenxa yolu ncedo.Itekhnoloji yokuguqula inciphisa indawo nge-30% ukuya kwi-60% xa kuthelekiswa neefom zokupakisha zendabuko.

Ekugqibeleni, kwisizukulwana esitsha se-high-speed, i-chips edibeneyo yokubonisa, ingxaki yokutshatyalaliswa kobushushu iya kuba ngumngeni omkhulu.Ngokusekwe kuhlobo olulodwa lwe-flip yepakethe ye-FC-BGA, umva we-chip unokuvezwa emoyeni kwaye unokususa ubushushu ngokuthe ngqo.Kwangaxeshanye, i-substrate inokuphucula ukusebenza kakuhle kokutshabalalisa ubushushu ngokusebenzisa umaleko wesinyithi, okanye ifakele isinki yobushushu yesinyithi ngasemva kwetshiphu, isomeleze ngakumbi isakhono sokutshabalalisa ubushushu, kwaye iphucule kakhulu uzinzo lwetshiphu. kwi-high-speed operation.

Ngenxa yeenzuzo zephakheji ye-FC-BGA, phantse zonke iitshiphusi zekhadi lokukhawulezisa imizobo zipakishwe ngeFC-BGA.

Ngaphambili: I-XC7VX485T-2FFG1761I Virtex®-7 T kunye ne-XT FPGAs ziyafumaneka kwi -3, -2, -1, kunye -2L isantya samabanga RoHS Compliant

Okulandelayo: XCVU9P-2FLGB2104I FPGA,VIRTEX ULTRASCALE,FCBGA-2104

Bhala umyalezo wakho apha kwaye uwuthumele kuthi