XCVU9P-2FLGB2104I FPGA,VIRTEX ULTRASCALE,FCBGA-2104
Ulwazi lweMveliso
| TYPENo.yeNgcaciso yeeBhloko: | 2586150 |
| Inani leeMacrocell: | 2586150Macrocells |
| Usapho lweFPGA: | Virtex UltraScale Series |
| Isimbo Semeko Yengqiqo: | FCBGA |
| Inani leZikhonkwane: | 2104Izikhonkwane |
| Inani lamaBanga esantya: | 2 |
| Iyonke iBits RAM: | 77722Kbit |
| Inani le-I/O's: | 778I/O's |
| Ulawulo Lwewotshi: | MMCM, PLL |
| Unikezelo lweVoltage Min engundoqo: | 922mV |
| UBonelelo lwe-Voltage Max: | 979mV |
| I/O Supply Voltage: | 3.3V |
| Ubuninzi boKusebenza: | 725MHz |
| Uluhlu lweeMveliso: | Virtex UltraScale XCVU9P |
| MSL: | - |
Intshayelelo yeMveliso
I-BGA imeleBall Grid Q Array Package.
Imemori efakwe kwitekhnoloji ye-BGA inokunyusa umthamo wememori ukuya kathathu ngaphandle kokutshintsha umthamo wememori, i-BGA kunye ne-TSOP
Xa kuthelekiswa nayo, inomthamo omncinci, ukusebenza kakuhle kokutshatyalaliswa kobushushu kunye nokusebenza kombane.Iteknoloji yokupakisha ye-BGA iphucule kakhulu indawo yokugcina i-intshi nganye yesikwere, isebenzisa iimveliso zememori ye-BGA yokupakisha phantsi komthamo ofanayo, umthamo wesinye kwisithathu sokupakishwa kwe-TSOP;Ukongeza, kunye nesithethe
Xa kuthelekiswa nephakheji ye-TSOP, iphakheji ye-BGA inendlela ekhawulezayo nesebenzayo yokuchitha ubushushu.
Ngophuhliso lwethekhnoloji yesekethe edibeneyo, iimfuno zokupakishwa kweesekethe ezidibeneyo zingqongqo.Oku kungenxa yokuba iteknoloji yokupakisha inxulumene nokusebenza kwemveliso, xa ubuninzi be-IC budlula i-100MHz, indlela yokupakisha yendabuko inokuvelisa into ebizwa ngokuba yi-"Cross Talk• phenomenon, kwaye xa inani lezikhonkwane ze-IC I-Pin enkulu kune-208, indlela yokupakisha yemveli inobunzima bayo, ngoko ke, ukongeza kusetyenziso lwe-QFP yokupakisha, uninzi lwezitshiphusi zokubala eziphezulu zanamhlanje (ezifana neetshiphusi zegraphics kunye neechipsets, njl. njl.) zitshintshelwa kwi-BGA (iBall Grid Array). I-PackageQ) iteknoloji yokupakisha.Xa i-BGA ibonakala, yaba lolona khetho lungcono kwi-high-density, i-high-performance, iipakethi ezininzi ze-pin ezifana ne-cpus kunye ne-mazantsi / North ibhulorho chips kwii-motherboards.
Itekhnoloji yokupakisha ye-BGA inokwahlulwa ngokweendidi ezintlanu:
1.PBGA (Plasric BGA) substrate: Ngokubanzi 2-4 umaleko wezinto eziphilayo eyakhiwe ibhodi multi- umaleko.Intel series CPU, Pentium 1l
Iiprosesa zeChuan IV zonke zipakishwe kule fomu.
I-2.CBGA (i-CeramicBCA) substrate: oko kukuthi, i-ceramic substrate, uxhumano lombane phakathi kwe-chip kunye ne-substrate ngokuqhelekileyo yi-flip-chip.
Uyifaka njani iFlipChip (iFC ngokufutshane).Intel series cpus, Pentium l, ll Pentium Pro processors zisetyenziswa
Uhlobo lwe-encapsulation.
3.FCBGA(FilpChipBGA) substrate: Hard-maleko amaninzi substrate.
4.TBGA (TapeBGA) substrate: I substrate iribhoni ethambileyo 1-2 umaleko PCB ibhodi yesekethe.
5.CDPBGA (iCarty Down PBGA) substrate: ibhekisa kwindawo yetshiphu ephantsi (eyaziwa ngokuba yindawo yomngxuma) embindini wephakheji.
Iphakheji ye-BGA inezi mpawu zilandelayo:
1) .10 Inani lezikhonkwane linyuswa, kodwa umgama phakathi kwezikhonkwane ukhulu kakhulu kunopakisho lwe-QFP, oluphucula isivuno.
2) .Nangona ukusetyenziswa kwamandla e-BGA kunyuswa, ukusebenza kokufudumala kombane kunokuphuculwa ngenxa yendlela yokulawulwa kwe-chip welding ye-collapse.
3).Ukulibaziseka kokuhanjiswa komqondiso kuncinci, kwaye i-adaptive frequency iphuculwe kakhulu.
4).Indibano ingaba yi-coplanar welding, ephucula kakhulu ukuthembeka.
