Uphuhliso oludibeneyo lwe-chip yesekethe edibeneyo kunye nephakheji edibeneyo yombane
Ngenxa ye-simulator ye-I/O kunye ne-bump spacing kunzima ukunciphisa ngophuhliso lwetekhnoloji ye-IC, ukuzama ukutyhala le ntsimi ukuya kwinqanaba eliphezulu i-AMD iya kwamkela itekhnoloji ye-7Nm ephucukileyo, ngo-2020 yasungulwa kwisizukulwana sesibini soyilo oluhlanganisiweyo ukuze lube yimpumelelo. i-core computing core, kunye ne-I / O kunye ne-memory interface chips usebenzisa iteknoloji evuthiweyo isizukulwana kunye ne-IP, Ukuqinisekisa ukuba ukuhlanganiswa kwesiseko sesibini sesibini esekwe kutshintshiselwano olungenasiphelo kunye nokusebenza okuphezulu, ngenxa ye-chip - ukudibanisa kunye nokudibanisa ukuyila ngokubambisana, ukuphuculwa kolawulo lwenkqubo yokupakisha (iwotshi, unikezelo lwamandla, kunye ne-encapsulation layer, iqonga lokudibanisa i-2.5 D lifikelela ngempumelelo kwiinjongo ezilindelekileyo, livula indlela entsha yophuhliso lweeprosesa zeseva eziphambili.