XC7A200T-2FBG676C Amacandelo ombane adityanisiweyo wesekethe ye-IC chip 100% entsha neyoqobo
Iimpawu zeMveliso
| UHLOBO | INKCAZO |
| Udidi | IiSekethe eziDityanisiweyo (ICs)Ifakwe |
| Mfr | AMD |
| Uthotho | IArtix-7 |
| Iphakheji | Itreyi |
| Ubume beMveliso | Iyasebenza |
| Inani le-LABs/CLBs | 16825 |
| Inani leLogic Elements/Seli | 215360 |
| Iyonke iBits RAM | 13455360 |
| Inani le-I/O | 400 |
| Umbane – Ubonelelo | 0.95V ~ 1.05V |
| Uhlobo lokuNqamisa | INtaba engaphezulu |
| Ubushushu bokusebenza | 0°C ~ 85°C (TJ) |
| Ipakethe / Ityala | 676-BBGA, FCBGA |
| Supplier Device Package | 676-FCBGA (27×27) |
| Inombolo yeMveliso esisiseko | XC7A200 |
Amaxwebhu & nemidiya
| UHLOBO LWEZIBONELELO | LINK |
| Amaxwebhu edatha | Artix-7 FPGAs DatasheetArtix-7 FPGAs emfutshane |
| IiModyuli zoQeqesho lweMveliso | Powering Series 7 Xilinx FPGAs kunye TI Power Management Solutions |
| Ulwazi lokusingqongileyo | Isiqinisekiso se-Xiliinx RoHSI-Xilinx REACH211 Cert |
| Imveliso ekhoyo | I-Artix®-7 FPGAUSB104 A7 Artix-7 iBhodi yoPhuhliso lweFPGA |
| Uyilo lwePCN/Inkcazo | IMult Dev Material Chg 16/Dec/2019ISaziso saMahala sokuHamba ngenqanawa 31/Oct/2016 |
| Errata | XC7A100T/200T Errata |
Ulwahlulo lokusiNgqongileyo nokuThunyela ngaphandle
| UMBALI | INKCAZO |
| Isimo seRoHS | I-ROHS3 iyahambelana |
| iNqanaba lokuSensitivity lokufuma (MSL) | 4 (72 iiyure) |
| FIKELELA kwiSimo | FIKELELA Ngokungachaphazelekiyo |
| ECCN | 3A991D |
| HTSUS | 8542.39.0001 |
Izibonelelo ezongezelelweyo
| UMBALI | INKCAZO |
| Amanye Amagama | 122-1865 |
| Ipakethe esemgangathweni | 1 |
Igama elipheleleyo le-FPGA yi-Field-Programmable Gate Array.I-FPGA yimveliso yophuhliso olongezelelweyo kwisiseko se-PAL, i-GAL, i-CPLD kunye nezinye izixhobo ezicwangcisiweyo.Njengomjikelezo owenziwe ngokwezifiso kwindawo ye-ASIC, i-FPGA ayisombululi kuphela ukunqongophala kwesekethe eyenziwe ngokwezifiso, kodwa iphinda yoyise ukusilela kwenani elilinganiselweyo lesekethe yesango lesixhobo sokuqala.Ngamafutshane, i-FPGA yitshiphu enokucwangciswa ukuba itshintshe ubume bayo bangaphakathi.
Kule minyaka imbalwa idlulileyo, indima yeFPGA kuphuhliso lothungelwano kunye neenkqubo zonxibelelwano iye yanda kakhulu ngaphaya kokusetyenziswa nje ukubhula ingqiqo phakathi kwamacandelo ahlukeneyo kwibhodi yesekethe edibeneyo.Izisombululo ezisekwe kwiFPGA zibonelela ngokusebenza, ukusebenza, kunye nokuguquguquka kwezisombululo zetshiphu ezizinikeleyo ngelixa kuncitshiswa iindleko zophuhliso.Ngokuhla kweendleko zezixhobo zeFPGA kunye nokunyuka koxinzelelo / ukusebenza, iiFPGA zanamhlanje zinokugubungela yonke into ukusuka kwisiphelo esisezantsi iDSLAM kunye nokutshintsha kwe-Ethernet ukuya kwezona ndlela ziphezulu ziphambili kunye nezixhobo zeWDM.
Ukuvela kwe-FPGA kwiimveliso zemoto kunye ne-automotive electronics technology izise utshintsho oluguquguqukayo, imboni yezimoto yehlabathi i-FPGA yokusetyenziswa kwesantya, ukusuka kwiprosesa yangaphambili ye-FPGA ye-monolithic ephuhliswe yaba yi-multi-FPGA iprosesa, okanye i-FPGA uluhlu lwe-high-speed processors.Iimveliso ze-elektroniki ze-Automotive ezisekelwe kwi-FPGA zinokuhlangabezana neemfuno zophuhliso lweemoto ezizayo, kwaye kwixesha leemodeli ezininzi zihlala kunye, iqonga le-hardware eliqhelekileyo elakhiwe kunye ne-FPGA njengoko ingundoqo inokufezekisa ukuhambelana ngeendlela ezahlukeneyo zokulayishwa kwesoftware.Ngophuhliso oluqhubekayo lwetekhnoloji ye-elektroniki yeemoto kwixesha elizayo, isantya seFPGA siya kuqhubeka siphucuka.
Ngokuphathelele kwimarike yemizi-mveliso, iye yaba yindawo ethe tyaba kodwa ekhula ngokuthe ngcembe kumzi-mveliso we-semiconductor.Xa kuthelekiswa nochulumanco lweemveliso zabathengi, imarike yeshishini ibonakala inokwethenjelwa ngakumbi, ngakumbi kwimarike enzima njengale yangoku, enika ishishini le-semiconductor ukufudumala.Kwizixhobo ezinamandla ezinje ngeFPGA, uphuhliso oluzinzileyo lwentengiso yeshishini luzise ithuba elikhulu lophuhliso.
