XCZU19EG-2FFVC1760E 100% Entsha kunye neyoqobo ye-DC ukuya kwi-DC Isiguquli kunye nokuTshintsha iChip yesiLawuli
Iimpawu zeMveliso
| Uphawu lweMveliso | Ixabiso lophawu |
| Umenzi: | Xilinx |
| Udidi lweMveliso: | SoC FPGA |
| Izithintelo zokuthumela ngenqanawe: | Le mveliso inokufuna uxwebhu olongezelelweyo ukuthumela ngaphandle ukusuka eUnited States. |
| RoHS: | Iinkcukacha |
| Isimbo sokuNqamisa: | SMD/SMT |
| Umqulu / Ityala: | FBGA-1760 |
| Undoqo: | I-ARM Cortex A53, i-ARM Cortex R5, i-ARM Mali-400 MP2 |
| Inani leMigoqo: | 7 Undoqo |
| Ubuninzi bewotshi yokuphindaphinda: | 600 MHz, 667 MHz, 1.5 GHz |
| Imemori yoMyalelo weCache ye-L1: | 2 x 32 kB, 4 x 32 kB |
| I-L1 Cache Data Memory: | 2 x 32 kB, 4 x 32 kB |
| Ubungakanani beMemori yeNkqubo: | - |
| Idatha ye-RAM Ubungakanani: | - |
| Inani leNgcaciso yeNgcaciso: | 1143450 LE |
| Iimodyuli zokuQiniseka eziqhelanisayo - ii-ALMs: | 65340 ALM |
| Inkumbulo eZinzisiweyo: | 34.6 Mbit |
| Umbane woNikezelo oSebenzayo: | 850 mV |
| Ubuncinci bobushushu bokusebenza: | 0 C |
| Obona bushushu bokusebenza: | + 100 C |
| Uphawu: | Xilinx |
| I-RAM esasaziweyo: | 9.8 Mbhithi |
| Ibhloko eZinzisiweyo ye-RAM-EBR: | 34.6 Mbit |
| Ukungevani kukufuma: | Ewe |
| Inani leLogic Array Blocks - ii-LABs: | 65340 LAB |
| Inani leeTransceivers: | 72 Isidluliseli |
| Uhlobo lweMveliso: | SoC FPGA |
| Uthotho: | XCZU19EG |
| Ubungakanani bePakethi yoMzi-mveliso: | 1 |
| Uluhlu olungaphantsi: | SOC - Iinkqubo kwiChip |
| Igama loRhwebo: | Zynq UltraScale+ |
Uhlobo lweSekethe eDityanisiweyo
Xa kuthelekiswa nee-electron, iifotoni azikho ubunzima obungaguqukiyo, ukusebenzisana okubuthathaka, amandla okuchasana nokuphazamiseka, kwaye zifaneleke ngakumbi ukuhanjiswa kolwazi.I-Optical interconnection kulindeleke ukuba ibe yitekhnoloji engundoqo yokuqhekeza udonga lokusetyenziswa kwamandla, udonga lokugcina kunye nodonga lonxibelelwano.I-Illuminant, coupler, imodyuli, izixhobo ze-waveguide zidityanisiwe kwiimpawu eziphezulu ze-optical density optical ezifana ne-photoelectric edibeneyo yenkqubo encinci, inokuqonda umgangatho, umthamo, ukusetyenziswa kwamandla okudibanisa kwe-photoelectric ephezulu, iqonga lokudibanisa i-photoelectric kuquka i-III - V i-compound semiconductor monolithic edibeneyo (INP ) iqonga lokudibanisa i-passive, i-silicate okanye iglasi (i-planar optical waveguide, i-PLC) iqonga kunye neqonga elisekelwe kwi-silicon.
I-platform ye-InP isetyenziselwa ukuveliswa kwe-laser, i-modulator, i-detector kunye nezinye izixhobo ezisebenzayo, inqanaba lobuchwepheshe obuphantsi, ixabiso eliphezulu le-substrate;Ukusebenzisa iqonga le-PLC ukuvelisa amacandelo angenayo, ilahleko ephantsi, umthamo omkhulu;Ingxaki enkulu kumaqonga omabini kukuba izinto azihambelani ne-silicon-based electronics.Olona ncedo lubalaseleyo lokudityaniswa kwe-silicon-based photonic kukuba inkqubo iyahambelana nenkqubo ye-CMOS kwaye ixabiso lemveliso liphantsi, ngoko ke ithathwa njengeyona nto inokubakho kwi-optoelectronic kunye neskimu sokuhlanganisa yonke into.
Kukho iindlela ezimbini zokudityaniswa kwezixhobo ze-silicon-based photonic kunye neesekethe ze-CMOS.
Inzuzo yangaphambili kukuba izixhobo zefotonic kunye nezixhobo zombane zinokuphuculwa ngokwahlukileyo, kodwa ukupakishwa okulandelayo kunzima kwaye izicelo zorhwebo zilinganiselwe.Le yokugqibela inzima ukuyila kunye nokuqhuba ukuhlanganiswa kwezi zixhobo zimbini.Okwangoku, indibano ye-hybrid esekwe kuhlanganiso lwamasuntswana enyukliya lolona khetho lulungileyo
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