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iimveliso

Umthengisi weSekethe eDityanisiweyo yoMxhasi LM2904 ADS8341E/2K5 OPT3001IDNPRQ1 TPS79101DBVRG4Q1 ic chip

inkcazelo emfutshane:


Iinkcukacha zeMveliso

Iithegi zeMveliso

Iimpawu zeMveliso

UHLOBO INKCAZO
Udidi Iinzwa, iiTransducers

IziBoni zoluvo-UkuKhanya okuNgqongileyo, i-IR, iiSensom ze-UV

Mfr Texas Instruments
Uthotho Iimoto, AEC-Q100
Iphakheji Iteyiphu & neReel (TR)

Sika iTape (CT)

Digi-Reel®

SPQ 3000T&R
Ubume beMveliso Iyasebenza
Uhlobo I-Ambient
Ubude bamaza 550nm
Ukufunyaniswa okukufutshane No
Uhlobo Lwemveliso I²C
Voltage - Unikezelo 1.6V ~ 3.6V
Ubushushu bokusebenza -40°C ~ 85°C
Uhlobo lokuNqamisa INtaba engaphezulu
Ipakethe / Ityala I-6-UDFN eveziweyo yePad
Supplier Device Package 6-USON (2x2)
Inombolo yeMveliso esisiseko OPT3001

 

1.Yintoni i-bonding (i-chip bonding kunye ne-bonding)

ukudibanisa yindlela yokudibanisa kwinkqubo yokuvelisa itshiphu, esetyenziswa ngokubanzi ukudibanisa ukujikeleza kwangaphakathi kwetshiphu kwizikhonkwane zepakethe ngocingo lwegolide phambi kokupakishwa, kwaye ngokubanzi emva kokudibanisa (oko kukuthi emva kokuba isekethe iqhagamshelwe kwizikhonkwane) ifakwe ngejeli emnyama ngelixa usebenzisa itekhnoloji yokupakisha yangaphandle ephezulu yeCOB (ChipOnBoard), le nkqubo kufuneka ivavanywe i-epitaxial wafer efakwe kwibhodi yesekethe ekhethekileyo, emva koko i-epitaxial wafer circuit eqhagamshelwe kwibhodi yesekethe ngocingo lwegolide, emva koko yanyibilika. kunye nomsebenzi okhethekileyo wokukhusela wezinto eziphilayo ezigutyungelwe ngamaqhekeza e-epitaxial ukugqiba i-post-encapsulation ye-chip.

2.Yintoni isemiconductor?

Masiqale ngokuba yintoni i-semiconductor.Ukususela kumbono wezinto eziphathekayo: i-semiconductor yimpahla eneepropati zokuqhuba phakathi kwezo zomqhubi kunye ne-insulator kwiqondo lokushisa.Njengobomi bemihla ngemihla, iingcingo zobhedu kunye ne-aluminium zi-conductor, ngelixa i-rubber kunye nezinto ezinjalo ziyi-insulators.Ngokubhekiselele kwi-conductivity yombane: i-semiconductor yimpahla ene-conductivity yombane elawulwayo, ukusuka kwi-insulator ukuya kwi-conductor.

Iipropati ezine ze-semiconductors.

Ukufunyanwa kwe-semiconductors kunokulandwa umva ukuya kuthi ga ngo-1833, xa uFaraday, isazinzulu saseBritani, kunye noyise wezobuchwephesha, waba ngowokuqala ukufumanisa ukuba ukuxhathisa kwesulfide yesilivere kwahluka ngamaqondo obushushu ngokwahlukileyo kulowo wentsimbi eqhelekileyo, eyayiyeyokuqala. ukufunyanwa kwesenzeko se-semiconductor.

Kodwa isishwankathelo seempawu ze-semiconductors ayizange igqitywe de kube nguDisemba 1947 yiBell Laboratories.

Ukushisa kuphakama, kwaye ukuchasana kwehla: ukuchasana kwe-semiconductor kunciphisa njengoko ukushisa kuphakama, kodwa, ngokuqhelekileyo, ukuchasana kwentsimbi kwandisa ngeqondo lokushisa.

Impembelelo ye-Photovoltaic: i-junction eyenziwe ngoqhagamshelwano phakathi kwe-semiconductor kunye ne-electrolyte ivelisa i-voltage xa ​​ibonakaliswe ekukhanyeni.

Impembelelo ye-Photoconductive: i-conductivity ye-semiconductor iyanda phambi kokukhanya.

Impembelelo yokulungiswa: ukuqhutyelwa kwe-semiconductor kukwalathiso kwaye kuhambelana nolwalathiso lwentsimi yombane esetyenzisiweyo.Yongeza i-voltage efanelekileyo kwiiphelo ze-semiconductor kwaye iyaqhuba;ukuba i-polarity ye-voltage iguqulwa, ayincedi.

 


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