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iimveliso

EP4CGX50CF23C8N iitshiphusi ezintsha ze-ic ezidityanisiweyo iisekhethi zombane amacandelo exabiso elingcono indawo enye thenga inkonzo yeBOM

inkcazelo emfutshane:


Iinkcukacha zeMveliso

Iithegi zeMveliso

Iimpawu zeMveliso

UHLOBO INKCAZO
Udidi IiSekethe eziDityanisiweyo (ICs)

Ifakwe

FPGAs (Field Programmable Gate Array)

Mfr Intel
Uthotho Cyclone® IV GX
Iphakheji Itreyi
Ipakethe esemgangathweni 60
Ubume beMveliso Iyasebenza
Inani le-LABs/CLBs 3118
Inani leLogic Elements/Seli 49888
Iyonke iBits RAM 2562048
Inani le-I/O 290
Umbane – Ubonelelo 1.16V ~ 1.24V
Uhlobo lokuNqamisa INtaba engaphezulu
Ubushushu bokusebenza 0°C ~ 85°C (TJ)
Ipakethe / Ityala 484-BGA
Supplier Device Package 484-FBGA (23×23)
Inombolo yeMveliso esisiseko EP4CGX50

Umlinganiselo weendleko zentengiso uzinzile, ngelixa umlinganiselo weendleko zeR&D kunye nomlinganiselo weendleko zolawulo uhla.Umlinganiselo weendleko zentengiso ka-2021, umlinganiselo weendleko zolawulo, kunye nomlinganiselo weendleko zezemali yi-6.66%, 4.35%, kunye -0.05% ngokulandelelanayo, nomlinganiselo weendleko zolawulo wehle ngepesenti eyi-1.7 kwaye umlinganiselo weendleko zeR&D wehle nge-2.2 yepesenti xa kuthelekiswa no-2020.

Umlinganiselo weendleko ze-R&D we-Shanghai Fudan ungaphezulu komndilili womgangatho woshishino.Nangona umlinganiselo weendleko zeR&D wenkampani wehlile kule minyaka mibini idlulileyo, inkampani igcine inqanaba eliphezulu lenkcitho yeR&D kwaye ikwinqanaba eliphezulu kushishino.Utyalo-mali oluqhubekayo noluzinzileyo lwe-R&D lunceda ekuphuculeni ukhuphiswano olungundoqo lwenkampani kunye nokukhusela isikhundla sayo sobunkokeli kwimarike kwindawo ye-niche.Izinga leendleko ze-R&D ze-Shanghai Fudan liphezulu kakhulu kunelo labanye abavelisi kwishishini, ngaphandle komlinganiselo omncinci wengeniso ye-Anlu Technology, esekho kwinqanaba lokuqala lokuthengisa iimveliso eziphezulu kwaye inezinga eliphezulu leendleko ze-R&D. ngaphezu kwenkampani.Kwintsimi yoyilo lwe-IC, enemiqobo ephezulu yobugcisa, uluhlu olubanzi lwenkampani yeemveliso ze-semiconductor kulindeleke ukuba zihlale zisexesheni kwaye ziphindaphindwa, kwaye zinokuqhubeka nokuhlangabezana neemfuno ezahlukeneyo zentengiso.

Iqela leR&D laseShanghai Fudan lizinzile.Ngo-2020 nango-2021, abasebenzi be-R&D benkampani baya kuba ngaphaya kwesiqingatha senani lilonke labasebenzi;ngo-2021, kuya kubakho ukuhla okuncinci kubasebenzi be-R&D, okubangelwa ikakhulu kukulahleka kwabasebenzi be-R&D ngenxa yemivuzo ephezulu kakhulu yezinye iinkampani zoontanga.Phakathi kweenkampani zontanga, inani labasebenzi be-R & D beZigong SMiT kunye ne-OnLu Technology liya kwanda nge-19.5% kunye ne-24.9% ngonyaka-ngonyaka kwi-2021. Ukuqwalasela ukuba i-Advan Technology igxininise kwii-chips ze-FPGA, i-Shanghai Fudan kulindeleke ukuba ibhekane noxinzelelo lokhuphiswano oluvela I-Ziguang SMiT kunye ne-Advan Technology kwintsimi ye-FPGA kunye nezinye iimveliso zokuthintela iteknoloji kwikamva.

Umlinganiselo weendleko zentengiso ye-Shanghai Fudan ikwindawo ephambili kushishino, kodwa kusekho umahluko kwiindleko zentengiso xa kuthelekiswa nabanye abathengisi abafana noZiguang SMi.Umlinganiselo weendleko zentengiso ka-2021 yi-6.66%, eyipesenti e-2 ubuncinane yamanqaku aphezulu kunoshishino.Nangona kunjalo, ixabiso leendleko zentengiso yi-172 yezigidi ze-RMB, eseyi-gap ethile xa kuthelekiswa ne-244 yezigidi ze-RMB ye-ZTE kunye ne-221 yezigidi ze-RMB ze-ZTE.Ukuya ekupheleni kuka-2021, iShanghai Fudan yayinabasebenzi abathengisayo abangama-270, ababalelwa kwi-17.64% yabasebenzi benkampani, iqela elikhulu kunoontanga bayo baseTshayina.

2. Imfuno yentengiso eyomeleleyo yeeFPGA ezenziwe eTshayina, kwaye inkampani inenzuzo yobunkokeli betekhnoloji.

Iichips zeFPGA (Field-Programmable Gate Array) yenye yamasebe abalulekileyo e-logic chips, esekelwe kwizixhobo ezicwangcisiweyo (PAL, GAL) kwaye zithathe indawo kwi-chip boom kwiminyaka yakutshanje kunye neempawu zabo ezizodwa ze-semi-customization. kunye neprogrammability, kwaye zibizwa ngokuba "ziitshiphusi zendalo yonke"."Ii-FPGAs zinezibonelelo zokucwangcisa intsimi, ixesha elifutshane ukuya kwimarike, ixabiso eliphantsi kune-ASICs elungiselelwe ngokupheleleyo, kunye nokuhambelana okukhulu kuneemveliso zenjongo jikelele (umzekelo, ii-CPUs).Kwiimeko zesicelo ezifana nokunxibelelana kwe-5G kunye nobukrelekrele bokufakelwa, apho indlela yetekhnoloji ingekacaciswanga ngokupheleleyo kwaye uphuculo olukhawulezileyo luyafuneka, ii-FPGAs zinokuncedisana ne-CPU ukubonelela ngezisombululo zenkqubo ezifanelekileyo.

(1) Xa kuthelekiswa ne-CPU, i-chip ye-FPGA ine-advanteji ecacileyo ye-computing, kwaye isantya sokulungiswa komfanekiso singcono kune-CPU, kwaye xa kuthelekiswa ne-GPU, i-FPGA inokuhlelwa ngokutsha kwaye inenzuzo ebonakalayo ekusebenziseni amandla.(2) Xa kuthelekiswa ne-ASICs, ii-chips ze-FPGA zinemijikelezo emifutshane yophuhliso kunye neengqungquthela ezimfutshane ze-chip, ezinokunceda iinkampani zinciphise ixesha labo ukuya kwimarike;Izisombululo ze-ASIC zineendleko ezizinzileyo ngelixa ii-FPGA ziphantse zingabikho, kodwa njengoko kunyuka ukusetyenziswa, izisombululo ze-ASIC zineenzuzo zeendleko ezininzi ngenxa yoqoqosho lwesikali.Ukongeza, iibhloko ze-logic kunye nokudibanisa ngaphakathi kwe-FPGAs zinokuthi ziyilwe ngamaxesha amaninzi ukwenza imisebenzi ye-logic eyahlukeneyo, kwaye indalo enokuhlengahlengiswa inceda abaphuhlisi bahlengahlengise ngokuguquguqukayo imisebenzi ye-chip ukwenzela ukuba utshintsho olukhawulezayo lwemveliso kunye nokulungelelanisa ngcono kwi-5G, i-AI, kunye nezinye iimfuno zesicelo.Ngokutsho kwedatha yeFrost & Sullivan, imakethi ye-FPGA yaseTshayina iya kukhula ukusuka kwi-6.56 yeebhiliyoni zeedola ngo-2016 ukuya kwi-15.03 yeebhiliyoni zeedola ngo-2020, kwi-CAGR ye-23.1%.Imakethi ye-FPGA yaseTshayina kulindeleke ukuba ifikelele kwi-33.22 yeebhiliyoni zeedola ngo-2025, kunye ne-CAGR emalunga ne-17% ukusuka ngo-2020 ukuya ku-2025.


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