I-JXSQ Entsha kunye neyoqobo ye-IC Chips REG BUCK ADJ 3.5A 8SOPWR LMR14030SDDAR izixhobo zombane
Iimpawu zeMveliso
UHLOBO | INKCAZO |
Udidi | IiSekethe eziDityanisiweyo (ICs) |
Mfr | Texas Instruments |
Uthotho | SIMPLE SWITCHER® |
Iphakheji | Iteyiphu & neReel (TR) Sika iTape (CT) Digi-Reel® |
SPQ | 2500T&R |
Ubume beMveliso | Iyasebenza |
Umsebenzi | Yehla |
Uqwalaselo Lwemveliso | Okuhle |
I-Topology | Buck |
Uhlobo Lwemveliso | Iyahlengahlengiswa |
Inani leZiphumo | 1 |
I-Voltage-Igalelo (uMzu) | 4V |
I-Voltage-Input (Ubukhulu) | 40V |
Voltage-Imveliso (Min/Fixed) | 0.8V |
Voltage-Imveliso (Ubukhulu) | 28V |
Okwangoku -Isiphumo | 3.5A |
Ukuphindaphinda-Ukutshintsha | 200kHz ~ 2.5MHz |
Ungqamaniso loLungisanisi | No |
Ubushushu bokusebenza | -40°C ~ 125°C (TJ) |
Uhlobo lokuNqamisa | INtaba engaphezulu |
Ipakethe / Ityala | 8-PowerSOIC (0.154", 3.90mm Ububanzi) |
Supplier Device Package | 8-SO PowerPad |
Inombolo yeMveliso esisiseko | LMR14030 |
1.Ii-wafers ze-Epitaxial kunye neechips zihlukile kwindalo, injongo kunye nokusetyenziswa.
I. Indalo eyahlukileyo
I-1, i-epitaxial wafer: i-epitaxial wafer ibhekisa kwifilimu ethile yekristale eyodwa ekhuliswe kwi-substrate substrate eshushu kwiqondo lobushushu elifanelekileyo.
I-2, i-chip: i-chip sisixhobo esiqinileyo se-semiconductor.I-chip yonke ifakwe kwi-epoxy resin.
Okwesibini, injongo yahlukile
I-1, i-epitaxial wafer: injongo ye-epitaxial wafer kukongeza i-electrodes kwi-epitaxial ukuququzelela ukutywinwa kunye nokupakishwa kwemveliso.
2, itshiphu: injongo yetshiphu kukuguqula amandla ombane abe ngamandla okukhanya okukhanyisa.
Ezintathu, ezahlukeneyo zokusetyenziswa
I-1, ii-epitaxial wafers: ii-epitaxial wafers ziyimfuneko kwinkqubo ephakathi kunye nenkqubo yangemva ye-chip ye-LED, ngaphandle kwayo, akunakwenzeka ukwenza i-semiconductor yokukhanya okuphezulu.
I-2, i-chip: i-chip yinto ephambili yokwenza izibane ze-LED, isikrini se-LED, ukukhanya kwe-LED.
2.Yintoni itshiphu?
I-chip yisekethe enkulu edibeneyo ye-microelectronic, enokuthiwa yi-IC;okt inguqulelo yesekethe eprintiweyo eyenziwe yancinci ukuya kwinqanaba le-nano (isigidi semilimitha).Icala langaphambili lebhodi yesekethe eprintiweyo eqhelekileyo lidla ngokuba linani elikhulu lamacandelo onomathotholo ahlukeneyo, kubandakanywa i-triodes, i-diodes, i-capacitors, i-electrolytic, i-resistors, i-mid-cycle regulators, i-switches, i-amplifiers, ii-detectors, izihluzi, njl. ziisekethe eziprintiweyo kunye ne-solder joints eziprintwe kwibhodi ye-carbon fiber.Yeyona mveliso iphambili yetekhnoloji ye-microelectronics kwaye inoluhlu olubanzi lwezicelo.Iichips zifakwe kwiikhompyuter zethu ezisetyenziswa ngokuqhelekileyo, iifowuni eziphathwayo, iimveliso zombane, izixhobo zombane, njl.;abantu bahlala bebhekisa kwiisekethe ezidibeneyo njengeetshiphusi.
3.Ukuqulunqwa kwezinto zangaphakathi zetshiphu
I-chip ligama eliqhelekileyo kwimveliso yecandelo le-semiconductor, eyenziwe ngezinto ze-semiconductor (ininzi i-silicon), kwaye iqulethe i-capacitors, i-resistors, i-diodes, kunye ne-transistors.I-semiconductor yinto phakathi komqhubi, njengobhedu, apho umbane unokudlula ngokulula, kunye ne-insulator, njenge-rubber, engabambi umbane.