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Ingcamango yokuPakisha:

Ingqiqo emxinwa: Inkqubo yokucwangcisa, ukudibanisa, kunye nokudibanisa iitshiphusi kunye nezinye izinto kwisakhelo okanye kwi-substrate usebenzisa iteknoloji yefilimu kunye neendlela ze-microfabrication, ezikhokelela kwii-terminals kunye nokuzilungisa ngokufaka i-potting medium insulating medium ukwenza isakhiwo esipheleleyo se-dimensional ezintathu.

Ukuthetha ngokubanzi: inkqubo yokudibanisa kunye nokulungisa ipakethe kwi-substrate, ukudibanisa kwinkqubo epheleleyo okanye isixhobo sombane, kunye nokuqinisekisa ukusebenza okubanzi kwenkqubo yonke.

Imisebenzi ephunyezwe ngokupakishwa kwetshiphu.

1. ukudlulisela imisebenzi;2. ukuhambisa imiqondiso yesekethe;3. ukubonelela ngendlela yokutshatyalaliswa kobushushu;4. ukhuseleko lwesakhiwo kunye nenkxaso.

Inqanaba lobuchwephesha lobunjineli bokupakisha.

Ubunjineli bokupakisha buqala emva kokuba i-chip ye-IC yenziwe kwaye ibandakanya zonke iinkqubo ngaphambi kokuba i-chip ye-IC ifakwe kwaye igxininiswe, idibaniswe, ifakwe, itywinwe kwaye ikhuselwe, idibaniswe kwibhodi yesekethe, kwaye inkqubo ihlanganiswe de imveliso yokugqibela igqitywe.

Inqanaba lokuqala: ekwabizwa ngokuba yi-chip level packaging, yinkqubo yokulungisa, ukudibanisa, kunye nokukhusela i-IC chip kwi-substrate yokupakisha okanye isakhelo esikhokelayo, okwenza imodyuli (indibano) icandelo elinokuthi lithathwe ngokulula kwaye lihanjiswe kwaye liqhagamshelwe. kwinqanaba elilandelayo lendibano.

Inqanaba 2: Inkqubo yokudibanisa iipakethe ezininzi ukusuka kwinqanaba 1 kunye namanye amacandelo e-elektroniki ukwenza ikhadi lesekethe.Inqanaba lesi-3: Inkqubo yokudibanisa amakhadi esekethe amaninzi ahlanganiswe kwiipakethi ezigqityiweyo kwinqanaba lesi-2 ukwenza icandelo okanye inkqubo encinci kwibhodi enkulu.

Inqanaba lesi-4: Inkqubo yokudibanisa iinkqubo ezininzi ezisezantsi zibe yimveliso ye-elektroniki epheleleyo.

Kwitshiphu.Inkqubo yokudibanisa amacandelo esekethe adibeneyo kwi-chip ikwabizwa ngokuba yi-zero-level packaging, ngoko ke ubunjineli bokupakisha bunokwahlulwa ngamanqanaba amahlanu.

Ukuhlelwa kweepakethe:

I-1, ngokwenani le-IC chips kwiphakheji: iphakheji ye-chip eyodwa (SCP) kunye ne-multi-chip package (MCP).

2, ngokwezinto zokutywinwa kwezinto ezibonakalayo: izinto zepolymer (iplastiki) kunye neekeramics.

I-3, ngokwesixhobo kunye nebhodi yesekethe yokudibanisa imowudi: uhlobo lokufakwa kwepini (PTH) kunye nohlobo lokunyuka kwendawo (SMT) 4, ngokwefom yokusabalalisa ipini: izikhonkwane ezisecaleni, izikhonkwane eziphindwe kabini, izikhonkwane ezine, kunye izikhonkwane ezisezantsi.

Izixhobo ze-SMT zinohlobo lwe-L, uhlobo lwe-J, kunye ne-I-type yentsimbi yezikhonkwane.

SIP:iphakheji yomqolo omnye SQP: iphakheji encinci ye-MCP: iphakheji yentsimbi ye-DIP: ipakethe yomqolo-mbini CSP: iphakheji yesayizi yetshiphu QFP: ipakethe eneflethi enecala elinesine PGA: iphakheji ye-matrix enechaphaza BGA: iphakheji yegridi yoluhlu lwebhola